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A kind of preparation method of ultra-sharp diamond wire saw and diamond wire saw

A diamond wire saw, ultra-sharp technology, applied in stone processing equipment, manufacturing tools, fine working devices, etc., can solve the problems of reducing the cutting force of the diamond wire, reducing the cutting force of the wire saw, and increasing the diameter of the diamond wire. The effect of reducing the wire diameter specification, increasing the roughness, and improving the cutting force

Active Publication Date: 2021-07-09
苏州韦度新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The diamond wire with this structure has the following problems: 1) Since the diamond powder used in the diamond wire is only 5 μm-50 μm, the process of pre-nickeling it is easy to make the diamond powder agglomerate. When two or three diamonds agglomerated together When deposited on the surface of the steel wire, it not only increases the diameter of the diamond wire and reduces the cutting force of the wire saw, but also tends to cause abnormalities such as line marks on the cut product during the use of the wire saw
2) During the cutting process, the nickel metal on the top of the diamond will be worn off, stick to the surface of the diamond wire or fall into the cutting fluid, which will also reduce the cutting force of the diamond wire to a certain extent

Method used

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  • A kind of preparation method of ultra-sharp diamond wire saw and diamond wire saw
  • A kind of preparation method of ultra-sharp diamond wire saw and diamond wire saw
  • A kind of preparation method of ultra-sharp diamond wire saw and diamond wire saw

Examples

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Effect test

Embodiment 1

[0046] Example 1 Using the technical solution of the present invention, an ultra-sharp electroplated diamond wire with a specification of 66±2 μm was prepared, and the preparation process was as follows:

[0047] S1: Surface treatment of diamond: use nickel-plated diamond powder with D50=7.5, and its nickel weight gain is 30%; treat its surface, such as Figure 4 Therefore, the specific steps are as follows:

[0048]a: High-temperature sintering: put the nickel-plated diamond powder into a muffle furnace for 6 hours under normal pressure and high temperature at 1200°C, and then lower it to room temperature;

[0049] b: Deplating reaction: Put the diamond micropowder after high temperature sintering into water, the ratio is 100g diamond: 1L water, stir, and slowly add 100ml of concentrated sulfuric acid, 50ml of 30% hydrogen peroxide in order to carry out the deplating reaction, after the deplating is completed, then Wash it with pure water and dry it for later use.

[0050] ...

Embodiment 2

[0058] Example 2 Using the technical solution of the present invention, an ultra-sharp electroplated diamond wire with a specification of 72±2 μm was prepared. The preparation process is as follows:

[0059] S1: Surface treatment of diamond: select nickel-plated diamond powder with D50=8.0, and its nickel weight gain is 25%-50%; treat its surface, such as Figure 4 Therefore, the specific steps are as follows:

[0060] a: High-temperature sintering: put the nickel-plated diamond powder into a muffle furnace for 6 hours under normal pressure and high temperature at 1200°C, and then lower it to room temperature;

[0061] b: Deplating reaction: Put the diamond micropowder after high temperature sintering into water, the ratio is 100g diamond: 1L water, stir, and slowly add 100ml of concentrated sulfuric acid, 50ml of 30% hydrogen peroxide in order to carry out the deplating reaction, after the deplating is completed, then Wash it with pure water and dry it for later use.

[006...

Embodiment 3

[0070] Example 3 Using the technical solution of the present invention, an ultra-sharp electroplated diamond wire with a specification of 60±2 μm was prepared, and the preparation process was as follows:

[0071] S1: Surface treatment of diamond: select nickel-plated diamond powder with D50=6.5, and its nickel weight gain is 25%-50%; treat its surface, such as Figure 4 Therefore, the specific steps are as follows:

[0072] a: High-temperature sintering: put the nickel-plated diamond powder into a muffle furnace for 6 hours under normal pressure and high temperature at 1200°C, and then lower it to room temperature;

[0073] b: Deplating reaction: Put the diamond micropowder after high temperature sintering into water, the ratio is 100g diamond: 1L water, stir, and slowly add 100ml of concentrated sulfuric acid, 50ml of 30% hydrogen peroxide in order to carry out the deplating reaction, after the deplating is completed, then Wash it with pure water and dry it for later use.

...

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Abstract

The invention discloses a preparation method of an ultra-sharp diamond wire saw and the diamond wire saw. The preparation method includes diamond surface treatment, steel wire surface cleaning, steel wire surface pretreatment, bare powder attachment, bare powder consolidation, wire take-up, etc. step. Among them, the surface treatment of diamond includes sub-steps such as high temperature sintering, deplating reaction, purification, pickling and electrification treatment, so as to make the diamond surface rough, increase the edges and corners of the diamond, and improve the holding force of the diamond on the steel wire; and the diamond The surface is no longer nickel-plated, but is treated with chemical methods to form diamond bare powder, so that it can be easily deposited on the steel wire substrate to achieve sanding on the bare powder. Therefore, the diamond wire saw of the present invention does not have the phenomenon of diamond powder agglomeration, the diameter of the diamond wire is thinner, the performance is more stable, and the loss of the raw material to be cut can be reduced; since the diamond is not wrapped with nickel metal, there is no nickel metal during cutting. The problem of wearing away the surface that sticks to the diamond wire, the cutting force is more durable.

Description

technical field [0001] The invention relates to a preparation method of a super-sharp diamond wire saw and the diamond wire saw. Background technique [0002] Diamond wire saw is a serrated wire cutting tool made by consolidating diamond abrasive on steel wire by electrodeposition method, referred to as "wire saw". Electroplated diamond wire has high cutting efficiency and excellent cutting surface quality, and is widely used in cutting non-metallic hard and brittle materials such as silicon wafers, crystals, sapphires and magnetic materials. One of the common features of these diamond wire materials is high value, thin diameter, high strength, and stable quality, which means high comprehensive benefits for customers, which is the development direction of diamond wire enterprises. [0003] However, since diamond is a non-conductor, the diamond wire of the existing diamond wire saw needs to be pre-plated with a layer of metal nickel on the surface of the diamond powder to ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D3/12C25D7/06C25D5/14B28D5/04
CPCB28D5/045C25D3/12C25D5/14C25D7/0607C25D15/00
Inventor 詹宝华
Owner 苏州韦度新材料科技有限公司
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