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A kind of preparation method of CEM-3 copper-clad laminate with high heat resistance and high cti

A technology of high heat resistance and copper clad laminates, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve the problems of poor heat resistance and high cost, and achieve low cost, good thermal conductivity, and improved heat resistance Effect

Active Publication Date: 2021-12-03
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing products on the market that can meet the above performance are generally high in cost, and most of them use aluminum hydroxide as a flame retardant filler, resulting in poor heat resistance of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A preparation method of a CEM-3 copper clad laminate with high heat resistance and high CTI, the steps are as follows:

[0030] (1) Preparation of surface material prepreg glue: 25 parts of bisphenol A type epoxy resin, 5 parts of bisphenol A type brominated epoxy resin, 2 parts of tetraphenol ethane tetraglycidyl ether epoxy resin, 3 parts Parts of dicyandiamide, 25 parts of silane coupling agent modified magnesium hydroxide, 5 parts of silane coupling agent modified talcum powder, 2.5 parts of antimony trioxide and 33 parts of DMF are mixed and stirred evenly;

[0031] (2) Preparation of lining prepreg glue: 23 parts of bisphenol A brominated epoxy resin, 3 parts of tetraphenol ethane tetraglycidyl ether epoxy resin, 3 parts of dicyandiamide, 37 parts of silane coupling Agent modified magnesium hydroxide, 5 parts of silane coupling agent modified talcum powder, 3 parts of antimony trioxide, 20 parts of DFM and 10 parts of acetone were mixed and stirred evenly;

[003...

Embodiment 2

[0036] A preparation method of a CEM-3 copper clad laminate with high heat resistance and high CTI, the steps are as follows:

[0037] (1) Preparation of surface material prepreg glue: 20 parts of bisphenol A type epoxy resin, 10 parts of bisphenol A type brominated epoxy resin, 2 parts of isocyanate modified epoxy resin, 3 parts of dicyandiamide, 20 parts Mix one part of silane coupling agent modified magnesium hydroxide, 5 parts of silane coupling agent modified talc powder, 5 parts of silane coupling agent modified silicon dioxide, 2 parts of antimony trioxide and 33 parts of DMF, and stir evenly;

[0038] (2) Preparation of lining prepreg glue: 20 parts of bisphenol A brominated epoxy resin, 2 parts of tetraphenol ethane tetraglycidyl ether epoxy resin, 3 parts of isocyanate modified epoxy resin, 5 parts Dicyandiamide, 30 parts of silane coupling agent modified magnesium hydroxide, 5 parts of silane coupling agent modified talcum powder, 7.5 parts of silane coupling agent ...

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PUM

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Abstract

The invention belongs to the technical field of copper clad laminate production, and relates to a preparation method of a CEM-3 copper clad laminate with high heat resistance and high CTI. The heat resistance of the copper-clad laminate prepared by the present invention can reach 288°C, no delamination and no blistering in floating soldering for more than 100s, and the heat resistance is significantly improved; the CTI reaches 600V; the flame retardancy reaches FV0 level; the thermal conductivity reaches 0.8 W / m·K; and use low-cost fillers, which are low-cost and can be used in the production of general LED lamps.

Description

technical field [0001] The invention relates to a copper clad laminate, in particular to a method for preparing a CEM-3 copper clad laminate with high heat resistance and high CTI, and belongs to the technical field of copper clad laminate production. Background technique [0002] With the popularization of LED lighting, product profit margins are constantly being squeezed, and LED lighting manufacturers urgently need a CCL product with low cost, good processing performance, and high production efficiency. CEM-3 becomes a The best choice for LED production to improve efficiency and reduce costs. [0003] The existing products on the market that can meet the above performance are generally high in cost, and most of them use aluminum hydroxide as a flame retardant filler, resulting in poor heat resistance of the product. Contents of the invention [0004] The present invention aims at the deficiencies in the prior art above, and provides a method for preparing CEM-3 copper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/14B32B15/20B32B17/04B32B17/06B32B33/00B32B37/06B32B37/10B32B38/08C08L63/00C08K13/04C08K7/00C08K7/14C08K3/22C08K9/06C08K3/34C08K3/36C08J5/24
CPCB32B5/02B32B15/14B32B15/20B32B17/061B32B33/00B32B37/06B32B37/10B32B38/08B32B2260/021B32B2260/046B32B2307/302B32B2307/306B32B2307/3065C08J5/24C08J2363/00C08K3/2279C08K3/34C08K3/36C08K9/06C08K2003/2224C08K2201/003
Inventor 杨永亮郑宝林陈长浩栾好帅王丽亚王彦
Owner SHANDONG JINBAO ELECTRONICS
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