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Telescopic flexible conductive film and preparation method thereof

A flexible conductive and conductive paste technology, applied to the conductive layer on the insulating carrier, cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of inability to stretch, increase of circuit resistance, Environmental pollution and other issues to achieve the effect of improving aesthetics and reducing the rate of resistance change

Pending Publication Date: 2019-10-25
GUANGDONG NANHAI ETETB TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] FPC based on the development of copper-clad PI film: in the production process, it is necessary to etch and pattern the copper-clad PI film, which will generate a large amount of waste liquid and pollute the environment; the FPC thus prepared has excellent bendability, It can still maintain the stability of the circuit resistance after many times of bending, but it cannot be stretched
[0005] FPC based on the development of flexible metal wires: in its production process, it is necessary to use sewing or weaving technology to achieve patterning. However, it is difficult to achieve mass production by sewing or weaving to achieve circuit patterning; the FPC thus prepared has excellent Bending, it can still maintain the stability of the circuit resistance after bending, but it only has limited stretching properties, generally not more than 10%
[0006] FPC based on the development of metal-coated elastic wires: in its production process, it is still necessary to use sewing or weaving technology to achieve patterning. Similarly, it is difficult to achieve mass production by sewing or weaving to achieve circuit patterning; FPC has excellent bending properties, and the change of circuit resistance after bending generally does not exceed 100%; Stretching hundreds of times, its resistance change is usually less than 100%, but its circuit resistance will increase significantly with stretching, which will have a certain adverse effect on its application
[0007] FPC based on the development of flexible silver paste: its production method is usually printed by screen on the substrate layer such as PET film (high temperature polyester film), PI or stretchable TPU film (thermoplastic polyurethane elastomer rubber film) Flexible silver paste to obtain a patterned circuit; the resulting FPC has good bendability and stretchability, but in general, as the number of times of bending or stretching increases, its resistance value becomes larger , and its recovery is not good, usually repeated stretching or bending less than 50-100 times, its circuit resistance will exceed 100%, thus limiting the service life of products using this FPC, and also hindering this Further popularization and application of a kind of FPC
[0008] To sum up, the FPCs commonly used at present generally do not have good bendability and stretchability at the same time. Repeated stretching or bending will cause a significant change in the resistance of the FPC.

Method used

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  • Telescopic flexible conductive film and preparation method thereof
  • Telescopic flexible conductive film and preparation method thereof
  • Telescopic flexible conductive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Main equipment: screen printing machine, gravure printing machine, dispensing machine, R2R two-way compound machine.

[0032] This example provides two kinds of nano-silver pastes, which are respectively marked as No. ① nano-silver paste and No. ② nano-silver paste. The specific formula composition is shown in Table 1.

[0033] Table 1 The formula composition of two kinds of nano-silver pastes provided by this embodiment

[0034]

[0035] 1. Preparation of flexible conductive film A:

[0036]S1. Pour No. ① nano-silver paste prepared in embodiment 1 into a screen printing machine, and print conductive patterns on one of the surfaces of the TPU film (equivalent to the first elastic substrate layer 1) of 75 μm; Baking at -150° C. for 15-60 minutes; after the baking, a non-fluid conductive circuit, ie, the conductive circuit layer 3 , is formed on the surface of the TPU film.

[0037] S2. Transfer the composite structure obtained after the S1 treatment to the R2R bidir...

Embodiment 2

[0134] 1. Experiment setup method

[0135] Stretchability experiment operation: set the tensile strain to 400%, and stretch the cycle 250 times.

[0136] Bendability test operation: use 2kg pressure, 180 degrees positive and negative folding 250 times.

[0137] 2. Data collection

[0138] The SX1944 digital four-probe tester characterizes the sheet resistance of the film, and takes 5 points evenly for each FPC to be tested.

[0139] 3. Test object

[0140] Experimental group: flexible conductive film A and flexible conductive film B prepared in Example 1, flexible conductive film A1 and flexible conductive film B1 prepared in Example 2, flexible conductive film A2 and flexible conductive film B2 prepared in Example 3;

[0141] Control FPC ①. Copper-clad PI film FPC (Shenzhen Qiyuanxing Electronics Co., Ltd.); Control FPC ②. Flexible metal wire FPC; For FPC ③. Metal-coated elastic braided flexible wire FPC (Dongguan Huaxing Rope Technology Co., Ltd.); Film ④. Flexible silve...

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Abstract

The invention relates to a telescopic flexible conductive film. The telescopic flexible conductive film includes a first elastic substrate layer, a conductive line layer and a second elastic substratelayer, wherein the first elastic substrate layer, the conductive line layer and the second elastic substrate layer are sequentially laminated, the composite structure thus formed has a non-stretchedcurved structure as a whole, the first elastic substrate layer is selected from one of a TPU elastic film, a PET elastic film or a PI elastic film, and the second elastic substrate layer is selected from one of the TPU elastic film, rubber, silicone rubber or a TPE elastic film. The telescopic flexible conductive film is advantaged in that the first elastic substrate layer, conductive lines and the second elastic substrate layer are jointly combined into a sandwich composite structure sandwiching among the conductive lines, the first elastic substrate layer and the second elastic substrate layer can provide effective surface protection and deformation buffering for the conductive lines disposed among the two, and the conductive film is kept light and thin and has good stretchability and bendability.

Description

technical field [0001] The invention belongs to the field of flexible circuit boards, and in particular relates to a stretchable flexible conductive film and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the demand for multifunctional, lightweight and thin and small electronic components has been growing rapidly. In future devices that are expected to be developed and utilized in the future, such as smart packaging for the Internet of Things, smart glasses, smart clothes, etc., flexible printed circuit boards (Flexible Printed Circuit Boards, FPCs) that are highly flexible and thin in structure have clearer Application prospects. [0003] At present, the bendable and stretchable FPC mainly includes: FPC based on the development of copper-clad PI film (polyimide film), FPC based on the development of flexible metal wires, FPC based on the development of metal-coated elastic wires, FPC based on FPC develop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14H01B1/22H01B13/00B82Y30/00
CPCH01B5/14H01B1/22H01B13/00B82Y30/00
Inventor 周炳明周虎高峰曾湘涛黄良辉
Owner GUANGDONG NANHAI ETETB TECH CO LTD
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