A high-performance interface preparation method based on carbon-carbon bonds

Abstract

The invention discloses a method for preparing a high-performance interface based on a carbon-carbon bond. By introducing a two-dimensional nanomaterial graphene between a carbon nanotube CNT and a metal, a mixed structure of CNT-graphene-metal-target substrate is obtained. Among them, CNT and graphene are homogeneously connected, graphene and metal are in "face-to-face" contact, and CNT and target substrate are connected to metal through graphene. This structure converts the "point-plane" van der Waals connection between CNT and metal with Schottky barrier into a homogeneous connection between graphene and CNT. Metal-graphene wraps the tip of CNT. In addition, graphene and metal- The "surface-to-surface" contact between the target substrates increases the contact force and contact area, which jointly improves the mechanical strength and boundary resistance between the four; at the same time, the combination of vertical and lateral thermal conductivity of CNT and graphene improves the thermal conductivity of the structure rate, so that the mechanical strength of the structure is enhanced, the thermal contact resistance is reduced, the generation of Joule heat is reduced, and the reliability and heat dissipation of the device are significantly improved.

Description

technical field [0001] The invention belongs to the technical field of micro-nano processing and production and preparation and application of nanomaterials, and more specifically relates to a high-performance interface preparation method based on carbon-carbon bonds. Background technique [0002] With the development of miniaturization of electronic products, the integration density inside the device continues to increase. In order to ensure the performance and life of the system, the three-dimensional integration method that has attracted much attention has become an important trend to maintain Moore's Law. The use of vertical dimensions can effectively increase the integration density, but at the same time it brings problems of long-term reliability and heat dissipation. The introduction of new materials, especially nanomaterials, has become a feasible solution. Among them, the one-dimensional nanomaterial carbon nanotube (Carbon Nanotube, CNT) has received extensive att...

AI Technical Summary

Problems solved by technology

[0006] In view of the defects of the prior art, the purpose of the present invention is to provide a high-performance interface preparation method based on carbon-carbon bonds, aiming at solving the problem of "point-surface" contact between CNT and metal and the existence of Schottky potential in the prior art. The reliability and heat dissipation of the resulting device caused by barriers

Images