Mems uncooled infrared detector thermal parameter test circuit and test method

Abstract

The invention relates to the field of electrical self-testing of thermal parameters of infrared detectors, in particular to a thermal parameter testing circuit and testing method of MEMS uncooled infrared detectors. The thermal parameter testing circuit of the MEMS uncooled infrared detector includes: a MEMS uncooled infrared detector array, including multiple rows and multiple columns of infrared sensitive units; an array gating switch, which is used to sequentially select the MEMS uncooled infrared detector array the sensitive unit in the sensor, and output the electrical signal generated by the selected sensitive unit to the amplification operation circuit; the amplification operation circuit performs amplification operation on the change of the electrical signal, and outputs the result of the amplification operation to the data processing module; the power supply module is used for Provide power to the infrared sensitive unit selected by the array gating switch; the data processing module calculates the device heat capacity C, thermal response time τ, thermal conductivity G, and blackbody response rate R according to the actual test data of the amplification operation circuit IR And infrared absorption efficiency η.

Description

technical field [0001] The invention relates to the field of electrical self-testing of thermal parameters of micro-nano devices, in particular to a test circuit and method for thermal parameters of MEMS uncooled infrared detectors based on self-heating effects. Background technique [0002] Micro-electromechanical systems (MEMS), also known as micro-electro-mechanical systems or micro-mechanical systems, are developed on the basis of microelectronics technology (semiconductor manufacturing technology). Common products include accelerometers, microphones, gyroscopes, humidity sensors, gas sensors, infrared detectors, and more. At present, thermal MEMS sensors based on the principle of thermal characteristics are widely used in national defense, medical, security, aerospace, environmental monitoring, automotive electronics and other fields, and have the characteristics of miniaturization, intelligence, multi-function, high integration and mass production. [0003] Infrared r...

AI Technical Summary

Problems solved by technology

[0005] At present, the determination of structure and process size for thermal parameter design mainly relies on rough design methods such as simulation and estimation, with large errors and long design cycles

Domestic testing of thermal parameters requires the use of scarce and expensive external testing equipment. The testing system is complex, inconvenient to operate, and low in testing efficiency. Especially for array devices, the time cost of testing is high.

Images