mems sensor thermal parameter test circuit and test method

Abstract

The invention relates to the field of electrical self-testing of thermal parameters of micro-nano devices, in particular to a MEMS sensor thermal parameter testing circuit and testing method. MEMS sensor thermal parameter test circuit includes: MEMS sensor array, including sensitive units with multiple rows and columns, each sensitive unit will self-heat and generate an electrical signal corresponding to its temperature after being powered on; Through the sensitive unit in the MEMS sensor array, and output the electrical signal generated by the selected sensitive unit to the operation circuit; the operation circuit performs amplification operation on the change of the electrical signal, and outputs the result of the amplification operation to the data processing unit; the power supply module, It is used to supply power to the sensitive unit selected by the array gating switch; the data processing unit calculates the device heat capacity C, thermal response time τ and thermal conductance G according to the actual test data of the operation circuit. It has the characteristics of simple circuit, fast measurement speed and high precision.

Description

technical field [0001] The invention relates to the field of electrical self-testing of thermal parameters of micro-nano devices, in particular to a MEMS sensor thermal parameter testing circuit based on an arithmetic circuit. Background technique [0002] Micro-electromechanical systems (MEMS), also known as micro-electro-mechanical systems or micro-mechanical systems, are developed on the basis of microelectronics technology (semiconductor manufacturing technology). Common products include accelerometers, microphones, gyroscopes, humidity sensors, gas sensors, infrared sensors, and more. At present, thermal MEMS sensors based on the principle of thermal characteristics are widely used in national defense, medical, security, aerospace, environmental monitoring, automotive electronics and other fields, and have the characteristics of miniaturization, intelligence, multi-function, high integration and mass production. [0003] Thermal MEMS sensors include two parts: a sensit...

AI Technical Summary

Problems solved by technology

[0004] At present, the determination of the structure and process size for thermal parameter design mainly relies on simulation, estimation and other methods, which have errors with the actual processing of the device, and the design cycle is long

However, domestic testing of thermal parameters requires the use of scarce and expensive external testing equipment. The testing system is complex and inconvenient to operate.

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