Substrate and peeling method

Abstract

The invention provides a substrate and a preparation method of a flexible light-emitting electroluminescent device. The substrate includes a first surface and a second surface opposite to the first surface. The first surface is provided with a plurality of first openings, the second surface is provided with a plurality of second openings, the first surface is used for carrying a film layer, the plurality of first openings and the plurality of second openings are in one-to-one correspondence and communicate with each other to form a plurality of hole channels, the surface energy of the first surface and the surface energy of the film layer are both smaller than the surface energy of inner surfaces of the hole channels, and the deviation of the surface energy of the film layer from the surface energy of the first surface is within + / -10%. By changing the surface performance of the substrate surfaces and the inner surfaces of the substrate hole channels, the rapid peeling of a flexible device and the substrate is achieved, and the peeling efficiency is improved. At the same time, the device and the substrate can be separated under the condition that the device is not mechanically damaged through the acting force of the etching medium destroying a sacrificial layer material and substrate contact interface, the stripping and preparation of the flexible device are completed, and thepreparation yield of the flexible device is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a substrate and a flexible electroluminescent device. Background technique [0002] The emergence of wearable electronic devices has brought great changes to people's lives and perceptions, mainly because wearable electronic devices can bring users a more perfect experience than traditional electronic devices. At the same time, the wearability of wearable electronic devices requires that the relevant electronic devices have good flexibility. Therefore, research on the preparation of flexible devices has attracted much attention in recent years. [0003] The preparation process of a general flexible device mainly includes the following steps: first, the flexible material is fabricated on a rigid substrate to form a flexible base layer; The device was peeled off from the substrate to obtain a flexible electroluminescent device. At present, the most widely...

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Problems solved by technology

However, since the base material is closely attached to the substrate during the preparation process, a large amount of heat will be generated during the peeling process to cause damage to the device, thereby reducing the yield of the device during the preparation process.

At the same time, laser stripping equipment is not only expensive, but the limitations of this stripping method itself also limit the effective improvement of stripping efficiency, and conventional substrates cannot effectively improve the problems existing in the stripping process.

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