PCB mounting process

A PCB board and mounting technology, applied in the field of PCB board mounting technology, can solve the problems of poor thermal conductivity of tin, unfavorable overall heat dissipation of components, and difficulty in heat dissipation of components

Active Publication Date: 2019-09-17
深圳市英创立电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When the PCB board is in use, on the one hand, the components can dissipate heat through the surrounding air, and on the other hand, they can dissipate heat through the solder joints; among commonly used metals (such as silver, iron, aluminum, copper, gold), tin has the worst thermal conductivity , making it difficult for components to dissipate heat through solder joints, which is not conducive to the overall heat dissipation of components

Method used

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Examples

Experimental program
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Embodiment 1-9

[0060] Embodiment 1-9: a PCB board mounting process, comprising the following steps:

[0061] Pretreatment: Spray a 75% ethanol solution on the PCB;

[0062] S1: Place a stencil on side A of the PCB, print solder paste and scrape off the solder paste on the surface of the stencil, and mount components;

[0063] S2: Pass the PCB board A side up through the reflow oven, and reflow solder the A side;

[0064] S3: Place a stencil on the B side of the PCB, print solder paste and scrape off the solder paste on the surface of the stencil, and mount the components;

[0065] S4: Pass the PCB board A side up through the reflow oven, and reflow solder the B side;

[0066] S5: After the solder paste on the A side and the B side are solidified, scrape and coat the thermal conductive silicone grease on the solder on the A side and the B side;

[0067] Among them, the reflow furnace includes a heating zone, a reflow soldering zone, and a cooling zone in sequence. The starting temperature ...

Embodiment 10

[0079] Embodiment 10: a PCB board mounting process, the difference from Embodiment 9 is that the PCB board mounting process includes the following steps:

[0080] In the pretreatment, spraying concentration is 80% ethanol aqueous solution on PCB board;

[0081] The initial temperature of the soldering zone in the reflow furnace is 180±1°C, and the PCB board stays in the soldering zone for 70s.

Embodiment 11

[0082] Embodiment 11: a PCB board mounting process, the difference from Embodiment 9 is that the PCB board mounting process includes the following steps:

[0083] In the pretreatment, spraying a concentration of 85% ethanol solution on the PCB;

[0084] The initial temperature of the soldering zone in the reflow furnace is 182±1°C, and the PCB board stays in the soldering zone for 70s.

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Abstract

The invention discloses a PCB mounting process and belongs to the technical field of circuit boards, and the problem of the poor heat dissipation in a soldering place of a PCB in the prior art is solved. The mounting process comprises the steps of (S1) printing solder paste on an A side of the PCB and mounting components, (S2) allowing the PCB to pass a reflow oven and performing reflow soldering on the A side, (S3) printing solder paste on a B side of the PCB and mounting components, (S4) allowing the PCB to pass the reflow oven and performing reflow soldering on the B side, and (S5) performing blade coating of heat-conducting silicone grease on soldering parts of the A side and B side after the solder pastes on the A side and the B side of the PCB are cured, wherein the solder pastes comprise the following parts including, by weight, 80 to 92 parts of nickel silver and tin alloy powder, and scaling powder including heat dissipating particles, and the weight ratio of the nickel silver and tin alloy powder to the scaling powder is (8.5-9):1. According to the invention, the heat dissipation performance of the soldering place is improved by using the alloy powder and the heat dissipating particles with high thermal conductivity.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a PCB board mounting process. Background technique [0002] PCB board, also known as circuit board, printed circuit board, replaces the method of wiring by printing; PCB board miniaturizes, centralizes and simplifies complex wiring and circuits of electronic components. The PCB board includes a single-sided board with parts concentrated on one side, a double-sided board with parts distributed on both sides, and a multi-layer board that can increase the wiring area. [0003] In the assembly of PCB boards, the most widely used technology and process is surface mount technology (SMT for short). Assembly technology. The SMT process sequence includes printing solder paste, bonding the column feet of the components to the solder paste to achieve component mounting, sending the mounted PCB board into the reflow furnace for reflow curing, cleaning, and testing; The reflow furna...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/341
Inventor 王启胜赵林森刘德荣宋日新夏明明
Owner 深圳市英创立电子有限公司
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