A method for on-line state monitoring of igbt module bonding wires

Abstract

A method for the online state monitoring of the IGBT module key line, including the following steps: Step 1: Create a full bridge inverter circuit and V CE Online measuring circuit, v CE The two input terminals of the online measuring circuit are connected to the IGBT power module of the IGBT power module of the whole bridge inverter circuit to achieve the whole bridge inverter circuit and V CE Online measurement circuit connection; step 2: establish a three -dimensional data model of healthy IGBT; step 3: Create the IGBT 3D data model of the key line break;The minimum daily support vector machine evaluates the status of the three -dimensional data model obtained by Step 2 and Step 3.The invention will be closely related to online monitoring and status assessment, which will help improve the health management mechanism of the IGBT module key line.

Description

technical field [0001] The invention relates to the fields of power electronics and electronic information science, in particular to a method for online state monitoring of IGBT module bonding wires, which utilizes a genetic algorithm to optimize the least squares support vector machine to evaluate the health of the IGBT bonding wires. Background technique [0002] Power converters are widely used in the fields of smart grid, rail transit and new energy, and the insulated gate bipolar transistor (IGBT) is the core device of the power converter, and its reliability is the guarantee for the safe operation of the system. Therefore, the IGBT On-line monitoring and status assessment are extremely important. Solder layer fatigue and bond wire detachment are the two main failure modes of IGBTs. Due to the continuous improvement of solder layer technology, IGBT module bond wire failure has received extensive attention. [0003] The patent application document with the application n...

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Problems solved by technology

[0003] The patent application document with the application number 201410072990.X and the publication number 104880657A discloses a fault detection method for IGBT devices and the corresponding detection circuit. Comparators corresponding to the number of bonding wires are set up, and the gate voltage signal is used to judge the fault of the IGBT. The number of bonding wires falling off, but the detection circuit is more complicated and the accuracy is not high

The patent application document with the application number 201710318198.1 and the publication number 107621782A discloses a fault diagnosis method for an IGBT module. By measuring the collector-emitter voltage drop value of the IGBT module in real time, the least squares support vector machine model with quantum ant colony optimization is used. Diagnoses the health status of the IGBT module, but does not consider the impact of changes in working conditions on the IGBT, and does not explain how to measure the collector-emitter voltage drop of the IGBT module

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