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Cyclohexyl LED packaging material and preparation method thereof

A technology of LED packaging and cyclohexyl, which is applied in the fields of electronic chemicals and polymer science, can solve the problems of high-temperature yellowing of phenyl, high-temperature yellowing, and ultraviolet aging yellowing, etc., and achieve high light transmittance and high refraction High index and high bond strength

Active Publication Date: 2022-01-18
矽时代材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that phenyl is prone to high-temperature yellowing and ultraviolet aging yellowing, the present invention uses saturated carbon-bonded cyclohexyl instead of phenyl to synthesize a material for LED packaging with high refractive index and high light transmittance
[0005] The present invention can solve the problem of easy yellowing at high temperature by combining silicon polymers containing vinyl and cyclohexyl groups, silicon-hydrogen bonds and cyclohexyl silicon polymers, and using cyclohexyl groups instead of phenyl groups, while cyclohexylpolysilane The refractive index can reach 1.51, without affecting the luminous efficiency of LED lights

Method used

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  • Cyclohexyl LED packaging material and preparation method thereof
  • Cyclohexyl LED packaging material and preparation method thereof

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Embodiment 1

[0047] As an embodiment of the cyclohexyl LED packaging material of the present invention, the cyclohexyl LED packaging material described in this embodiment includes the following components by weight:

[0048] 100 g of cyclohexyl vinyl silicone resin, 100 g of cyclohexyl hydrogen silicone resin, 0.02 g of inhibitor (methyl ethynyl alcohol), 0.08 g of platinum catalyst (5000 ppm) coordinated by methyl vinyl siloxane, and adhesive (ene Propyl glycidyl ether) 4g.

[0049] The preparation method of the cyclohexyl LED encapsulation material of the present embodiment comprises the following steps:

[0050] (1) preparation of cyclohexyl vinyl elastomeric polymer:

[0051] (1a) Add 15 grams of methylvinyldimethoxysilane, 150 grams of dicyclohexyldimethoxysilane, 150 grams of methylcyclohexyldimethoxysilane, and cyclohexyltriethoxysilane into a 3000ml four-necked flask. 120 grams of base silane, 800 grams of xylene and 1 gram of zinc benzoate, stirred evenly;

[0052] (2a) Add 800...

Embodiment 2

[0062] As an embodiment of the cyclohexyl LED packaging material of the present invention, the cyclohexyl LED packaging material described in this embodiment includes the following components by weight:

[0063] Cyclohexyl vinyl silicone resin 100g, cyclohexyl hydrogen-containing silicone resin 200g, inhibitor (methyl ethynyl alcohol) 0.06g, methyl vinyl siloxane coordinated platinum catalyst (3000ppm) 0.3g, adhesive (ene Propyl glycidyl ether) 5g.

[0064] The preparation method of the cyclohexyl LED encapsulation material of the present embodiment comprises the following steps:

[0065] (1) Preparation of cyclohexyl vinyl silicone resin:

[0066] (1a) Add 60 g of trimethyl-ethoxysilane, 300 g of cyclohexyltriethoxysilane, 50 g of methylcyclohexyldimethoxysilane, 100 g of dicyclohexyldimethoxysilane, 100g tetraethyl orthosilicate, 100g butanol, 1000g xylene and 1.2g aluminum triisopropoxide, stir well;

[0067] (1b) Add 1000g of distilled water dropwise when the temperatur...

Embodiment 3

[0079] As an embodiment of the cyclohexyl LED packaging material of the present invention, the cyclohexyl LED packaging material described in this embodiment includes the following components by weight:

[0080] 50 g of cyclohexyl vinyl silicone resin, 200 g of cyclohexyl hydrogen-containing silicone resin, 0.025 g of inhibitor (methyl ethynyl alcohol), 0.25 g of platinum catalyst (3000 ppm) coordinated by methyl vinyl siloxane, adhesive (ene Propyl glycidyl ether) 5g.

[0081] The preparation method of the cyclohexyl LED packaging material of the present embodiment comprises the following steps:

[0082] (1) Preparation of cyclohexyl vinyl silicone resin:

[0083] (1a) Add 50 grams of trimethyl-ethoxysilane, 15 grams of vinyldimethylethoxysilane, 250 grams of cyclohexyltriethoxysilane, and vinyltriethoxysilane into a 5000ml four-necked flask. 15 grams, 20 grams of methylvinyldimethoxysilane, 84 grams of methylcyclohexyldimethoxysilane, 150 grams of dicyclohexyldimethoxysila...

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Abstract

The invention discloses a cyclohexyl LED packaging material, which comprises the following ingredients in parts by weight: 100 parts of silicon polymer containing vinyl and cyclohexyl, and 100-1000 parts of silicon polymer containing silicon-hydrogen bond and cyclohexyl. The material is a silicone material with a high refractive index (refractive index ≥ 1.51), which has the characteristics of high transparency, high temperature yellowing resistance, and excellent UV aging resistance. It is an ideal LED packaging material. At the same time, the invention also discloses a preparation method of the cyclohexyl LED packaging material.

Description

technical field [0001] The invention relates to the technical fields of electronic chemicals and polymers, in particular to a cyclohexyl LED packaging material and a preparation method thereof. Background technique [0002] As the world's most attention-grabbing new-generation light source, LED is known as the most promising green lighting source in the 21st century because of its advantages such as high brightness, low heat, long life, non-toxicity, and recyclability. China is a big country in LED packaging. It is estimated that 80% of the world's LED device packaging is concentrated in China, distributed in various US-funded, Taiwan-funded, Hong Kong-funded and domestic-funded packaging companies. With the continuous maturity of technology and the accumulation of brand reputation, Chinese LED packaging companies will surely play an important and leading role in China, a country with large LED applications. Epoxy resin has general high temperature heat resistance and poor ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05H01L33/56
CPCC08L83/04H01L33/56C08L2205/025C08L2203/206C08L2201/08
Inventor 易太生柯明新杨晖宇
Owner 矽时代材料科技股份有限公司
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