Copper-aluminum composite substrate and pressure diffusion welding method and application thereof

A copper-aluminum composite, diffusion welding technology, applied in chemical instruments and methods, lamination, conductive materials, etc., can solve the problems of poor mechanical and electrical properties of metal compounds, difficult alloy processing, etc., to avoid electrochemical corrosion, improve The effect of service life and cost reduction

Active Publication Date: 2019-09-10
JILIN ZHONG YING HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, the above-mentioned method also has the following disadvantages: since the metals are connected by metal bonds, metal compounds will be formed, but the mechanical properties and electrical conductivity of the metal compounds are relatively poor. What it obtains is an amorphous solid solution. The amorphous metal structure is a metastable structure. Under certain conditions (such as high temperature and strong impact), it will transform into a more stable state-crystalline state and become Ordinary crystalline metals, this amorphous alloy is difficult to process, and it is currently difficult to apply to industrial production, especially in electrical terminals in the automotive field

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  • Copper-aluminum composite substrate and pressure diffusion welding method and application thereof
  • Copper-aluminum composite substrate and pressure diffusion welding method and application thereof
  • Copper-aluminum composite substrate and pressure diffusion welding method and application thereof

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Embodiment 1

[0057] In this embodiment, pressure diffusion welding is used to provide a copper-aluminum composite substrate, the copper-aluminum composite substrate includes a copper substrate and an aluminum layer; the aluminum layer is arranged on at least one of the copper substrates On the surface, between the copper base and the aluminum layer is a copper-aluminum mixture layer in which copper-aluminum atoms interpenetrate or combine copper-aluminum atoms.

[0058] In this example, in order to demonstrate the effect of the proportion of the copper-aluminum crystalline mixture in the copper-aluminum mixture layer on the performance of the copper-aluminum composite substrate, different copper-aluminum mixtures were produced using the same thickness and material of the copper substrate and the aluminum layer The proportion of the copper-aluminum crystalline mixture in the layer was sampled, and a series of mechanical and electrical tests were done. The experimental results are shown in Ta...

Embodiment 2

[0067] In this embodiment, pressure diffusion welding is used to provide a copper-aluminum composite substrate, the copper-aluminum composite substrate includes a copper substrate and an aluminum layer; the aluminum layer is arranged on at least one of the copper substrates On the surface, between the copper base and the aluminum layer is a copper-aluminum mixture layer in which copper-aluminum atoms interpenetrate or combine copper-aluminum atoms.

[0068] The pressure diffusion welding processing method of the copper-aluminum composite substrate includes:

[0069] Pretreatment step: after cleaning the copper substrate and the aluminum layer, preheat the copper substrate raw material and / or the copper substrate raw material to 500° C. with high-frequency electromagnetic waves;

[0070] Fixing step: placing the copper matrix raw material and the aluminum layer raw material in a punching machine;

[0071] Stamping step: use a punching machine to stamp the aluminum layer and th...

Embodiment 3

[0083] In this embodiment, pressure diffusion welding is used to provide a copper-aluminum composite substrate, the copper-aluminum composite substrate includes a copper substrate and an aluminum layer; the aluminum layer is arranged on at least one of the copper substrates On the surface, a copper-aluminum mixture layer is formed between the copper substrate and the aluminum layer in which copper-aluminum atoms interpenetrate or combine copper-aluminum atoms, and the copper-aluminum mixture layer contains at least 50wt% copper-aluminum crystalline mixture.

[0084] The pressure diffusion welding processing method of the copper-aluminum composite substrate includes:

[0085] Pretreatment step: after cleaning the copper substrate and the aluminum layer, preheating the copper substrate raw material and / or the copper substrate raw material with high-frequency electromagnetic waves;

[0086] Fixing step: placing the copper matrix raw material and the aluminum layer raw material in...

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Abstract

The invention discloses a copper-aluminum composite substrate comprising a copper matrix and an aluminum layer. The aluminum layer is disposed on at least one surface of the copper matrix, and a copper-aluminum mixture layer in which copper and aluminum atoms are interpenetrated or copper and aluminium atoms are bonded to each other is formed between the copper matrix and the aluminum layer, withthe copper-aluminum mixture layer containing at least 50 wt% of a copper-aluminum crystalline mixture. The invention also discloses a pressure diffusion welding method and application of the copper-aluminum composite substrate. A problem of electrochemical corrosion in copper-aluminum connection is solved, and a material which can replace a copper material to manufacture a copper-aluminum connecting electrical terminal is provided, allowing copper-aluminum connection to have long service lifetime, low processing cost and less energy consumption.

Description

technical field [0001] The invention relates to the technical field of conductive metal materials, in particular to a conductive copper-aluminum composite base material, a pressure diffusion welding processing method of this material and its application in making terminal blocks and electrical joints. Background technique [0002] Copper or copper alloy materials have good electrical conductivity, thermal conductivity, and plasticity, and are widely used in the field of electrical connections. However, there is a shortage of copper resources, and the content of copper in the earth's crust is only about 0.01%. As the service life increases, the cost of copper will increase year by year. For this reason, people begin to look for the substitute of metallic copper to reduce cost. [0003] The content of metal aluminum in the earth's crust is about 7.73%. After the refining technology is optimized, the price is relatively low, and it also has excellent electrical conductivity, t...

Claims

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Application Information

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IPC IPC(8): B32B15/01B32B37/10B32B37/06H01R4/58H01B1/02
CPCB32B15/017B32B37/10B32B37/06H01R4/58H01B1/023H01B1/026B32B2307/714
Inventor 王超
Owner JILIN ZHONG YING HIGH TECH CO LTD
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