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Self-wetting nanometer fluid capable of enhancing micro-nano structure heat transfer, preparation method and applications thereof

A nanofluid and self-wetting technology, applied in the field of enhanced heat transfer, can solve the problems of reduced heat transfer coefficient and critical heat flow, nanoparticle blocking capillary structure, unstable heat transfer performance, etc., to improve critical heat flow and enhance heat transfer Performance, the effect of improving local heat transfer

Inactive Publication Date: 2019-08-30
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, although these two hot spots can improve the heat transfer efficiency of micro-nano scale heat transfer devices, there are still some problems, such as large fluid circulation resistance, unstable heat transfer performance, possible reduction of heat transfer coefficient and critical heat flow, Nanoparticles clog capillary structures, etc.

Method used

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  • Self-wetting nanometer fluid capable of enhancing micro-nano structure heat transfer, preparation method and applications thereof
  • Self-wetting nanometer fluid capable of enhancing micro-nano structure heat transfer, preparation method and applications thereof
  • Self-wetting nanometer fluid capable of enhancing micro-nano structure heat transfer, preparation method and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Weigh Cu nanoparticles (average particle diameter 50nm, bulk density 0.25g / cm 3 ), n-heptanol aqueous solution, and polyoxyethylene 40 stearate were mixed directly, and the prepared mixed solution was stirred by a magnetic stirrer for 15 minutes, then dispersed by ultrasonic oscillation for 2 hours, and finally stirred by a magnetic stirrer for 15 minutes, so that the mixed solution could form a uniform Self-wetting nanofluid with special wettability and good dispersibility and stability (the mass concentration of Cu nanoparticles is 1.5%, the concentration of n-heptanol is 2.0×10 -3 mol / l, polyoxyethylene 40 stearate concentration 1.0×10 -7 mol / l).

Embodiment 2

[0031] Under vacuum conditions, put the self-wetting Cu nanofluid prepared in Example 1 into a double-layer glass reactor container, heat the self-wetting Cu nanofluid in the reactor for 20 minutes, recover the liquid after steam condensation, and measure the volume of the recovered liquid . The same volume of conventional Cu nanofluid was used instead of the self-wetting nanofluid, and the previous experiment was repeated under the same experimental conditions. The conventional Cu nanofluid preparation method is basically the same as the self-wetting Cu nanofluid preparation method in Example 1, the difference is that deionized water is used instead of n-heptanol aqueous solution as the base liquid, specifically with a concentration of 1.0 × 10 -7 The mol / l sodium dodecylbenzenesulfonate solution replaces the compound n-heptanol aqueous solution and polyoxyethylene 40 stearate as a dispersant.

[0032] Comparing the volumes of liquid collected in the two experiments, it was ...

Embodiment 3

[0036] The preparation process of the self-wetting nanofluid is basically the same as in Example 1, the only difference is that the average particle diameter of the Cu nanoparticles is replaced by 20nm and 80nm respectively, and the stirring time of the magnetic stirrer before and after the two times is adjusted to 12min, The self-wetting nanofluids were prepared separately. And replace the self-wetting nanofluid in Example 2 with the above-mentioned self-wetting nanofluid, and find that the steam condensate obtained by the above-mentioned self-wetting nanofluid is 21.0% and 19.9% ​​more than the steam condensate obtained by the conventional Cu nanofluid , Comparing the conductivity of the steam condensate obtained from the above self-wetting nanofluid with the conductivity of the base liquid, it is found that the difference between the two is 8.5% and 7.9%, respectively. In this example, the base liquid refers to an aqueous solution of n-heptanol at the same concentration as ...

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Abstract

The invention discloses a self-wetting nanometer fluid capable of enhancing micro-nano structure heat transfer, a preparation method and applications thereof, wherein the fluid comprises Cu nanoparticle, a nonionic surfactant and a long-chain alcohol molecule aqueous solution. According to the present invention, the long-chain alcohol molecular aqueous solution and the nonionic surfactant are compounded to maintain the stable dispersion performance of the Cu nanoparticles in the flow boiling heat transfer, the surface tension of the long-chain alcohol molecule aqueous solution is increased along with the increase of the temperature, and the marangoni convection is formed in the flow boiling heat transfer, such that the critical heat flow is increased, the nucleation barrier is reduced, andthe possibility of the decomposition of the nanoparticles on the heat transfer surface is reduced so as to achieve the excellent heat transfer enhancement property of the self-wetting nanometer fluid.

Description

technical field [0001] The invention relates to the field of enhanced heat transfer, in particular to a self-wetting nanofluid capable of enhancing heat transfer of a micro-nano structure, a preparation method and an application. Background technique [0002] The high-frequency and high-speed development of electronic components and integrated circuit technology has led to a sharp increase in the heat generation per unit volume of electronic chips, and the heat flux generated during the operation of the computer CPU has reached 60-100W / cm 2 , even up to 10 in semiconductor lasers 3 W / cm 2 . The reliability of electronic equipment is extremely sensitive to temperature, and the reliability will drop by 5% for every 1°C increase in device temperature at the level of 70-80°C. Therefore, high heat flow poses a great threat to the reliability of normal operation of components. The failure caused by high temperature accounts for 50% of all electronic product failures, and heat d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/08
CPCC09K5/08
Inventor 王小伍黄敏兴赵纯郑立贤
Owner SOUTH CHINA UNIV OF TECH
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