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Flexible array microelectrode manufacturing method

A flexible array and micro-electrode technology, which is applied in directions such as the use of electric/magnetic devices to transmit sensing components, can solve problems such as large electrode resistance, and achieve the effects of small thickness, simple preparation steps and low cost

Active Publication Date: 2019-08-20
HEBEI UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method has relatively high requirements for the solution, and is limited to very dilute solutions, and is not suitable for viscous conductive inks, so the prepared electrodes have relatively high resistance

Method used

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  • Flexible array microelectrode manufacturing method
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  • Flexible array microelectrode manufacturing method

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Embodiment 1

[0045] This embodiment provides a method for preparing a flexible tactile sensor array microelectrode, comprising the following steps:

[0046] (1) Customize the mask of the electrode pattern. Customize the mask of the electrode pattern according to the design requirements, such as figure 2 shown;

[0047] (2) Cut the photosensitive dry film to the same size as the mirror stainless steel plate, and seal the photosensitive dry film and the mirror stainless steel plate well through a plastic sealing machine to ensure that the photosensitive dry film and the mirror stainless steel plate are closely attached.

[0048] (3) The side of the mask with ink is in contact with the side of the plastic-sealed photosensitive dry film and fixed with adhesive tape, and placed in an exposure machine for ultraviolet exposure. The exposure time is 40s. The shape of the channel can be projected on the photosensitive dry film.

[0049] (4) Prepare a developing solution with deionized water and...

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PUM

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Abstract

The invention discloses a flexible array microelectrode manufacturing method. The method adopts a viscous flexible substrate, uses a high-conductivity material as an electrode material, and adopts a micro-electrode coating technology based on soft lithography to achieve a sub-millimeter size and below. . The method comprises the following steps of making a mould with an electrode pattern; punchingat circular positions of two ends of a channel of the electrode pattern by using a puncher; putting the punched mould into an ion bonding machine, making the channel face upwardly during placing, vacuumizing and carrying out plasma treatment; mixing conductive ink and diluent, then placing in an ultrasonic cleaning machine to carry out ultrasonic concussion and mix uniformly, and injecting the diluted conductive ink from one end of a hole with a needle and an injection syringe having the same size with the puncher in the second step till that a channel is filled with the conductive ink; and after reheating, tearing the mould from the viscous flexible substrate, and cutting two head portions with the hole of the viscous flexible substrate, and leaving only an electrode portion and a wiringportion. Flexibility is ensured and simultaneously low cost and a high resolution are realized.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, and relates to a method for preparing a flexible array microelectrode, which can quickly and economically produce various flexible and wearable structures and devices. Background technique [0002] The rapid development of electronic sensor technology and organic materials has led to major breakthroughs in flexible electronics. The characteristics of stretching, bending, and folding can adapt to the sensing requirements of real-time structural changes, making flexible electronic devices have a wide range of application prospects. [0003] A key technology of flexible electronic devices is the preparation of flexible array microelectrodes. Flexible array microelectrodes need to be developed through the development of new materials and the improvement of processing technology. The performance index of the device is developing in the direction of higher resolution and more accurate acc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D5/24
CPCG01D5/24
Inventor 刘吉晓王曼菲郭士杰王鹏马冀飞侯福宁
Owner HEBEI UNIV OF TECH
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