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High-entropy alloy preparation method and device based on laser cladding deposition

A laser cladding deposition, high-entropy alloy technology, applied in the field of high-entropy alloys, can solve problems such as limited manufacturing applications, achieve the effects of improving plasticity, improving crack resistance, and suppressing cracks in high-melting point high-entropy alloys

Inactive Publication Date: 2019-08-13
XI AN JIAOTONG UNIV
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Problems solved by technology

The existence of cracks limits the application of high-melting-point high-entropy alloys in the manufacture of large-scale and complex structural parts in aerospace

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  • High-entropy alloy preparation method and device based on laser cladding deposition
  • High-entropy alloy preparation method and device based on laser cladding deposition

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Embodiment Construction

[0028] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] see figure 1 , a method for preparing a high-entropy alloy based on laser cladding deposition according to an embodiment of the present invention, comprising the following steps:

[0030] Step 1, select three or more from the high-melting point metal elemental powder tungsten, niobium, molybdenum, tantalum, zirconium and rhenium with an initial particle size diameter of 45-105 μm and a purity greater than or equal to 99.5wt.%. The proportions whose atomic number percentage is between 5% and 35% are weighed in turn and mixed uniformly.

[0031] Step 2, adding to the uniformly mixed powder in step 1, low-melting point metal elemental powder titanium with an atomic number accounting for 1% to an equimolar ratio with other elemental metal powders, an initial particle size diameter of 45-105 μm, and a purity greater than 99.5wt.%....

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Abstract

The invention discloses a high-entropy alloy preparation method and device based on laser cladding deposition. The method comprises the following steps: mixed powder A is prepared; the mixed powder Acomprises three, four, five or six in metal simple-substance powder of tungsten, niobium, molybdenum, tantalum, zirconium and rhenium; the atom number percentage of each metal element in the mixed powder A is within 5-35%; powder B is uniformly mixed in the obtained mixed powder A to obtain mixed powder C; the powder B comprises one or more in metal simple-substance powder of titanium, vanadium and hafnium; a substrate of the device for realizing the laser cladding deposition is preheated; and then, the laser cladding deposition method is used for molding the mixed powder C. Through mixing ofthe low-melting-point metal simple-substance powder of titanium, vanadium or hafnium, and meanwhile, through reduction of the temperature gradient between the substrate and a clad layer by preheating,the crack elimination and inhibition in the preparation of high-melting-point high-entropy alloys based on the laser cladding deposition can be achieved.

Description

technical field [0001] The invention belongs to the technical field of high-entropy alloys, in particular to a method and device for preparing high-entropy alloys based on laser cladding deposition. Background technique [0002] High-entropy alloys are composed of n (n≥3) elements with approximately equimolar concentrations, and have thermodynamic high-entropy effects, dynamic slow diffusion effects, structural lattice distortion effects, and performance "Cocktail" effect and structural stability; high-entropy alloys tend to form a multi-component solid solution structure with a simple phase structure, and the solid solution strengthening effect is extremely strong. In addition, the precipitation of a small amount of ordered phases and the appearance of nanocrystalline and amorphous phases will further strengthen the high-entropy alloy; therefore, high-entropy alloys also have high-temperature thermal stability, high hardness, high strength, and high wear resistance. Corros...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10
CPCC23C24/106
Inventor 张航陈子豪李青宇李涤尘赵懿臻王兴理想
Owner XI AN JIAOTONG UNIV
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