Method for expanding high-capacity chip by using single-type chip and high-capacity chip

A large-capacity chip technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problem of high plate-making costs and achieve the effect of reducing layout design costs

Inactive Publication Date: 2019-07-12
珠海博雅科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the circuit layout design process, a new circuit layout needs to be redesigned for memory chips with different capacities. For manufacturers, the initial plate-making costs are very high, so it can be seen that there are only a few chip samples released by memory chip manufacturers. capacity

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  • Method for expanding high-capacity chip by using single-type chip and high-capacity chip
  • Method for expanding high-capacity chip by using single-type chip and high-capacity chip
  • Method for expanding high-capacity chip by using single-type chip and high-capacity chip

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Embodiment Construction

[0023] This part will describe the specific embodiment of the present invention in detail, and the preferred embodiment of the present invention is shown in the accompanying drawings. Each technical feature and overall technical solution of the invention should not be construed as limiting the protection scope of the present invention.

[0024] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0025] In the descriptio...

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Abstract

The invention discloses a method for expanding a high-capacity chip by using a single-type chip and a high-capacity chip. The method comprises the following steps: connecting at least two storage chips of the same type on the same wafer through a control circuit module, to form a single storage chip combination, the control circuit module comprising an addressing circuit, and the addressing circuit being connected to all the storage chips in the storage chip combination to realize data transmission addressing of any one storage chip; and slicing the storage chip combination to form a high-capacity chip. A plurality of single-type or single-capacity storage chips are selected on a wafer, the storage chips are connected through the control circuit module, to form a high-capacity chip, so theexpenditure of redesigning a circuit board layout for the chips with different capacities by a manufacturer can be reduced, the production of the chips with different capacities is realized, the costis lower, and the market adaptability is high.

Description

technical field [0001] The invention relates to the field of memory chip design, in particular to a method for expanding a large-capacity chip with a single type of chip and the large-capacity chip. Background technique [0002] The production of semiconductor memory chips is usually realized on the wafer. The wafer is sliced ​​after photolithography to obtain a single memory chip (Die), and then the single memory chip is packaged in batches. It can be seen from the above manufacturing process that the highly integrated There is a single type of memory chip on the wafer produced by globalization. To obtain memory chips of different types or different capacities, it is necessary to prepare the corresponding circuit layout in advance in the photolithography stage, and the circuit layout depends on the circuit design. [0003] In the circuit layout design process, a new circuit layout needs to be redesigned for memory chips with different capacities. For manufacturers, the init...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/392
Inventor 张登军马亮查小芳赵士钰刘大海杨小龙安友伟李迪逯钊琦
Owner 珠海博雅科技股份有限公司
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