A kind of silica gel composition, its preparation method and bonding process

A silicone composition and workpiece technology, applied in the field of packaging and bonding, can solve the problems of unsuitable bonding and packaging requirements, achieve high processability, low curing temperature, and broaden the application field

Active Publication Date: 2021-08-31
GUANGDONG INST OF RARE METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It cannot be used in occasions that require high bonding and packaging, such as touch screens, chip-scale packaging, and polymer materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] The preparation method of the silica gel composition provided by the embodiment of the present invention includes mixing the raw materials containing polyvinyl silicone oil, hydrogen-containing silicone oil, MQ silicone resin, inhibitor, and platinum catalyst in a solvent, and then removing the solvent; wherein, MQ silicon The resin accounts for 45-50 wt% of the raw material.

[0032] In an optional embodiment of the present invention, the polyvinyl silicone oil has a vinyl content of 1.2-1.5%, and a viscosity of 6000 MPa·s-80000 MPa·s. The selection of such vinyl content and viscosity, combined with the proportion of MQ silicone resin of 45-50wt%, ensures that the silicone composition is solid at room temperature.

[0033] In an optional embodiment of the present invention, the MQ silicone resin includes methyl MQ silicone resin or vinyl MQ silicone resin, and when vinyl MQ silicone resin is used, the vinyl content of the vinyl MQ silicone resin is 0.2-3.0%.

[0034] ...

Embodiment 1

[0045] This implementation provides a preparation method of a silica gel composition and an encapsulation process using the silica gel composition. The preparation method and process comprise the following steps:

[0046] 50g of vinyl silicone oil with a vinyl content of 1.4%, 10.8g of hydrogen-containing silicone oil with a hydrogen content of 0.36%, 60.8g of methyl MQ resin, 40g of cyclohexane (solvent), methylbutyl 0.02g of acetylenic alcohol and 0.08g of 5000ppm platinum catalyst were stirred and mixed evenly, and the solvent and air bubbles were removed to form a uniform and transparent solid silica gel composition. Heat the composition to 50°C to soften, take out a part, apply it on the release paper and press it into a film, peel off the release paper and stick the film on a glass plate, and then press another glass plate on the film, the film has two upper and lower sides. Press the glass plate tightly and heat it at 80°C for 20 minutes to cure and complete the bondin...

Embodiment 2

[0049] This implementation provides a preparation method of a silica gel composition and an encapsulation process using the silica gel composition. The preparation method and process comprise the following steps:

[0050] 50g of vinyl silicone oil with a vinyl content of 1.22% with a viscosity of 80000MPa·s, 4.24g of hydrogen-containing silicone oil with a hydrogen content of 0.8%, 44.4g of methyl MQ resin, 30g of cyclohexane (solvent), ethynyl ring 0.02 g of hexanol and 0.1 g of 5000 ppm platinum catalyst were stirred and mixed evenly, and the solvent and air bubbles were removed to form a uniform and transparent solid silica gel composition. Heat the composition to 55°C to soften, take out a part, apply it on the release paper and press it into a film, peel off the release paper and stick the film on a glass plate, and then press another glass plate on the film, the film has two upper and lower sides. Press the glass plate tightly and heat it at 85°C for 20 minutes to cure ...

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Abstract

The invention discloses a silica gel composition, a preparation method and a bonding process thereof, and relates to the technical fields of bonding and packaging. The silica gel composition includes vinyl silicone oil, hydrogen-containing silicone oil, MQ silicone resin, inhibitor and platinum catalyst, and the MQ silicone resin accounts for 45-50 wt% of the total weight. It can be softened and has a certain fluidity when heated to 50-60°C, and can be cured when heated to 80-90°C, and can form a strong bond with the workpiece. Therefore, the silicone composition can be first heated to 50-60°C to soften it, applied to the workpiece, and then heated to 80-90°C to completely and quickly solidify to realize the encapsulation and bonding of the workpiece. It is suitable for low-temperature calendering and casting processes, and has the advantages of easy construction, low energy consumption, green environmental protection, etc., and has a low curing temperature, which can meet the bonding of some temperature-sensitive workpieces.

Description

technical field [0001] The invention relates to the technical field of bonding and encapsulation, and in particular to a silica gel composition, a preparation method and a bonding process thereof. Background technique [0002] The traditional solid silica gel uses peroxide as the vulcanization initiator, and the initiation temperature is 150-200°C. It needs to be equipped with large-scale vulcanization equipment, which cannot meet the packaging and bonding of temperature-sensitive substrates, chips, devices, and substrates. Traditional solid silica gel is difficult to be used in packaging and bonding of electrical and electronic, photovoltaic industry, polymer composite materials, etc. [0003] Addition-type liquid silicone is generally a two-component formula. It is mixed in proportion when used, and cured at room temperature or heated. When it is used for packaging and bonding of substrates, chips, devices, and substrates, it is generally sprayed, rolled, and brushed. For...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05C09J183/04B32B37/12
Inventor 高丽霞朱淮军戴子林李桂英吴海鹰
Owner GUANGDONG INST OF RARE METALS
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