Chemical nickel palladium gold production line and production technology

Abstract

The invention provides a chemical nickel palladium gold production line. The chemical nickel palladium gold production line comprises a conveying mechanism, a pre-treatment area, a chemical nickel palladium gold area and a post-treatment area, wherein the pre-treatment area, the chemical nickel palladium gold area and the post-treatment area are sequentially adjacently arranged on a moving route of the conveying mechanism. According to the chemical nickel palladium gold production line, the pre-treatment, chemical nickel palladium gold and the post-treatment in chemical nickel palladium gold production are integrated in one production line, so that the labor is saved, and the processes are decreased; in addition, the manufacturing and use cost of the production line are reduced. Additionally, the invention provides a chemical nickel palladium gold technology. The technology involves chemical nickel plating of a soft board, a chemical nickel plating of a hard board, palladium reducing,palladium replacing, gold reducing and gold replacing; and three nickel bathes, three palladium bathes and three gold bathes are formed in the production line. The production line integrates all demands in the chemical nickel palladium gold production technology; and the manufacturing cost and the use coat are decreased.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an electroless nickel-palladium-gold production line and a production process. Background technique [0002] As the functions and signals of integrated circuits continue to increase, a large number of I / O requirements and signal transmission quality have become the current trend, and the requirements for high frequency are increasing, and the surface treatment technology required for circuit board and chip welding is also increasing. Needs to be greatly improved. The increase in high frequency also needs to improve the electron migration ability that the product needs to withstand, and the chemical nickel palladium gold (ENEPIG) has good adhesion ability, and the nickel layer can effectively prevent the diffusion of copper atoms. Nickel-palladium-gold forms an intermetallic compound (IMC) which is quite smooth after being given energy, which can effectively block the...

AI Technical Summary

Problems solved by technology

[0004] At present, the nickel-palladium-gold production process needs to be transferred between various production lines. This process requires a lot of manpower, and the circuit board is prone to damage such as scratches. At the same time, in order to avoid the contamination of the circuit board during the transfer process, the Re-cleaning is required before the next stage of treatment. The above problems will not only prolong the treatment process, increase production costs and labor costs, but also generate a large amount of sewage and pollute the environment.

In addition, the current production line cannot produce soft boards and hard boards at the same time. There are two types of electroless palladium plating and electroless gold plating baths: replacement type and reduction type. Different types of plating bath production lines are used separately.

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