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Single-component epoxy adhesive with low viscosity, high temperature resistance and high air tightness and preparation method of epoxy adhesive

An epoxy adhesive, low-viscosity technology, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of silicone adhesive sealing performance, rubber rings that cannot achieve the ideal sealing effect, and product qualification rate reduction, etc. , to achieve high temperature and high humidity performance, good sealing performance, and the effect of improving production pass rate

Pending Publication Date: 2019-05-31
DOCBOND TECH DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the improvement of electronic products' requirements for sealing and waterproof performance, more and more electronic product accessories manufacturers have begun to design and develop in this area, mainly using adhesive products to seal the gap, and most companies use rubber rings or silicone Adhesive, but these two materials have big problems, the rubber ring can hardly achieve the ideal sealing effect, although the silicone adhesive is better than the rubber ring in sealing performance, but because these electronic product accessories have to be subjected to high temperature after sealing treatment Reflow soldering once or twice, high temperature will have a great impact on the sealing performance of the silicone adhesive, which will reduce the qualified rate of the product. Therefore, further improvement is needed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The present invention provides a one-component, low-viscosity, high-temperature-resistant, high-air-tightness epoxy adhesive, which is composed of the following raw materials:

[0036] 100 parts of epoxy resin,

[0037] 50 parts of polyol,

[0038] 50 parts of acid anhydride curing agent,

[0039] 10 parts of amine curing agent,

[0040] 1 part of pigment or color paste. .

[0041] In this embodiment, the epoxy resin is a mixture of glycidyl epoxy resin and cycloaliphatic epoxy resin in a ratio of 1:1.

[0042] In the present embodiment, the polyhydric alcohol is diethylene glycol, dipropylene glycol, trimethylolpropane, glycerin, polyester polyol, polyether polyol according to 1:1:1:1: 1:1 to form a mixture.

[0043] In this embodiment, the acid anhydride curing agent is phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride Diformic anhydride, hexahydrophthalic anhydri...

Embodiment 2

[0056] The present invention provides a one-component, low-viscosity, high-temperature-resistant, high-air-tightness epoxy adhesive, which is composed of the following raw materials:

[0057] 50 parts of epoxy resin,

[0058] 25 parts polyol,

[0059] 25 parts of acid anhydride curing agent,

[0060] 5 parts of amine curing agent,

[0061] 1 part of pigment or color paste. .

[0062] In this embodiment, the epoxy resin is a mixture of glycidyl epoxy resin and cycloaliphatic epoxy resin in a ratio of 1:1.

[0063] In the present embodiment, the polyhydric alcohol is diethylene glycol, dipropylene glycol, trimethylolpropane, glycerin, polyester polyol, polyether polyol according to 1:1:1:1: 1:1 to form a mixture.

[0064] In this embodiment, the acid anhydride curing agent is phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride Diformic anhydride, hexahydrophthalic anhydride, m...

Embodiment 3

[0077] The present invention provides a one-component, low-viscosity, high-temperature-resistant, high-air-tightness epoxy adhesive, which is composed of the following raw materials:

[0078] 80 parts of epoxy resin,

[0079] 50 parts of polyol,

[0080] 30 parts of acid anhydride curing agent,

[0081] 5 parts of amine curing agent,

[0082] 1 part of pigment or color paste. .

[0083] In this embodiment, the epoxy resin is a mixture of glycidyl epoxy resin and cycloaliphatic epoxy resin in a ratio of 1:1.

[0084] In the present embodiment, the polyhydric alcohol is diethylene glycol, dipropylene glycol, trimethylolpropane, glycerin, polyester polyol, polyether polyol according to 1:1:1:1: 1:1 to form a mixture.

[0085] In this embodiment, the acid anhydride curing agent is phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride Diformic anhydride, hexahydrophthalic anhydride...

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Abstract

The invention provides a single-component epoxy adhesive with low viscosity, high temperature resistance and high air tightness. The single-component epoxy adhesive with low viscosity, high temperature resistance and high air tightness consists of the following raw materials in percentages: 30-100 parts of epoxy resin, 10-50 parts of polyol, 5-50 parts of an anhydride curing agent, 1-10 parts of an amine curing agent and 0.1-1 part of pigment or color paste. The adhesive is low in viscosity and small in fineness, is suitable for automatic dispensing or glue spraying production, and has excellent sealing performance.

Description

technical field [0001] The invention relates to the technical field of adhesive preparation, in particular to a single-component, low-viscosity, high-temperature-resistant, high-air-tightness epoxy adhesive and a preparation method thereof. Background technique [0002] With the improvement of electronic products' requirements for sealing and waterproof performance, more and more electronic product accessories manufacturers have begun to design and develop in this area, mainly using adhesive products to seal the gap, and most companies use rubber rings or silicone Adhesive, but these two materials have big problems, the rubber ring can hardly achieve the ideal sealing effect, although the silicone adhesive is better than the rubber ring in sealing performance, but because these electronic product accessories have to be subjected to high temperature after sealing treatment Reflow soldering once or twice, after high temperature, will have a great impact on the sealing performa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/08
Inventor 郑健保张君莫华
Owner DOCBOND TECH DEV CO LTD
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