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Polyimide film, copper-clad laminate, and circuit substrate

A technology of polyimide layer and polyimide film, which is applied in the direction of circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of insufficient dielectric properties, decreased flame retardancy, and dimensional changes of polyimide films high rate issues

Pending Publication Date: 2019-05-21
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, regarding the polyimide film formed of the above-mentioned polyimide, although the dielectric constant at 10 GHz is 3.2 or less, the dielectric tangent exceeds 0.01, and the dielectric properties are not yet sufficient.
In addition, polyimides using such aliphatic monomers have problems such as large linear expansion coefficients, large dimensional change rates of polyimide films, and decreased flame retardancy.

Method used

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  • Polyimide film, copper-clad laminate, and circuit substrate
  • Polyimide film, copper-clad laminate, and circuit substrate
  • Polyimide film, copper-clad laminate, and circuit substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0212] Examples are shown below, and the features of the present invention will be described in more detail. However, the scope of the present invention is not limited to the examples. In addition, in the following examples, unless otherwise specified, various measurements and evaluations used the following.

[0213] [Determination of viscosity]

[0214] Using an E-type viscometer (manufactured by Brookfield, trade name: DV-II+Pro), the viscosity at 25°C was measured. The rotation speed is set so that the torque becomes 10% to 90%, and after 2 minutes have passed after the start of the measurement, the value when the viscosity is stable is read.

[0215] [Measurement of glass transition temperature (Tg)]

[0216] Regarding the glass transition temperature, a dynamic viscoelasticity measuring device (DMA: manufactured by UBM Co., Ltd., trade name: E4000F) was used. From 30°C to 400°C, the temperature was increased at a rate of 4°C / min and a frequency of 11Hz to 5mm×20mm. The polyimi...

Synthetic example A-1

[0257] Under nitrogen flow, put 1.335 g of m-TB (0.0063 mol) and 10.414 g of TPE-R (0.0356 mol) into a 300-ml separable flask, and DMAc with a solid content concentration of 12% by weight after polymerization. Stir and dissolve at room temperature. Next, after adding 0.932 g of PMDA (0.0043 mol) and 11.319 g of BPDA (0.0385 mol), stirring was continued for 3 hours at room temperature, and polymerization reaction was performed to obtain a polyamic acid solution A-1. The solution viscosity of the polyamic acid solution A-1 was 1,420 cps.

[0258] Next, after applying the polyamic acid solution A-1 uniformly on one side (surface roughness Rz: 2.1 μm) of an electrolytic copper foil with a thickness of 12 μm so that the cured thickness becomes approximately 25 μm, the temperature was heated at 120°C. Dry under heating and remove the solvent. Furthermore, stepwise heat treatment is performed from 120°C to 360°C within 30 minutes to complete imidization. With respect to the obtained ...

Synthetic example A-2

[0260] Under nitrogen flow, 0.451 g of m-TB (0.0021 mol) and 11.794 g of TPE-R (0.0403 mol) and DMAc with a solid content concentration of 12% by weight after polymerization were put into a 300-ml separable flask. Stir and dissolve at room temperature. Next, after adding 2.834 g of PMDA (0.0130 mol) and 8.921 g of BPDA (0.0303 mol), stirring was continued for 3 hours at room temperature and polymerization reaction was performed to obtain a polyamic acid solution A-2. The solution viscosity of the polyamic acid solution A-2 was 1,510 cps.

[0261] Next, after applying the polyamic acid solution A-2 uniformly on one side (surface roughness Rz: 2.1 μm) of an electrolytic copper foil having a thickness of 12 μm so that the cured thickness becomes approximately 25 μm, the temperature was heated at 120°C. Dry under heating and remove the solvent. Furthermore, stepwise heat treatment is performed from 120°C to 360°C within 30 minutes to complete imidization. With respect to the obtai...

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PUM

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Abstract

Provided is a polyimide film having a non-thermoplastic polyimide layer, wherein: the non-thermoplastic polyimide constituting the non-thermoplastic polyimide layer preferably contains at least one ofa biphenyl-tetracarboxylic dianhydride (BPDA) residue derived from 3,3',4,4'-BPDA and a phenylenebis(trimellitic monoester) dianhydride (TAHQ) residue derived from 1,4-TAHQ, as well as at least one of a pyromellitic dianhydride (PMDA) residue derived from PMDA and a napthalenetetracarboxylic dianhydride (NTCDA) residue derived from 2,3,6,7-NTCDA, the total amount of these residues being at least80 mol parts with respect to 100 mol parts of a tetracarboxylic acid residue; and the dielectric loss tangent (Df) is preferably 0.004 or less.

Description

Technical field [0001] The invention relates to a polyimide film, a copper laminated board and a circuit substrate. Background technique [0002] In recent years, with the progress of miniaturization, weight reduction, and space saving of electronic devices, flexible printed wiring boards (flexible printed wiring boards) that are thin, lightweight, flexible, and have excellent durability even when repeatedly bent The demand for printed circuit boards (Flexible Printed Circuits, FPC) has increased. Regarding FPC, three-dimensional and high-density installation can be achieved even in a limited space. Therefore, for example, it is used in electronic devices such as hard disk drives (HDD), digital video disks (Digital Video Disk, DVD), and smart phones. The use of moving parts, wiring, cables, connectors and other parts is gradually expanding. [0003] In addition to the above-mentioned higher density, higher performance of equipment has been promoted, and therefore, it is also nece...

Claims

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Application Information

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IPC IPC(8): B32B27/34C08G73/10H05K1/03
CPCC08J5/18C08G73/10B32B27/281B32B15/20B32B15/08H05K1/0346H05K1/0393H05K3/022B32B2307/206B32B2307/734B32B2457/00C08J2379/08B32B27/34H05K2201/0133H05K2201/0154C09D179/08B32B7/02B32B7/12B32B27/08B32B27/06B32B2250/40B32B27/36B32B27/20B32B2270/00B32B2307/538B32B2307/30B32B2307/54B32B2307/732B32B2307/204B32B2457/08
Inventor 安藤智典西山哲平须藤芳树森亮
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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