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A kind of electroforming liquid used in K gold electroforming process

An electroforming liquid and electroforming technology, applied in electroforming, electrolysis process, etc., can solve the problems of high processing cost, increased gold consumption, high product price, etc., and achieve three-dimensional and full shape, less gold consumption, and durable products Effect

Inactive Publication Date: 2020-04-10
深圳市昊扬电铸技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the production of K gold jewelry is still mainly based on lost wax casting of plaster molds. The disadvantages of this process are that the product is heavy, the style is flat, the surface is rough, and it is difficult to process, and the product price is high.
[0003] The K gold products produced by the traditional lost wax casting process are solid, the product is heavy, the amount of gold used is increased, and the surface of the product is rough, the processing is difficult, and the processing gold loss is high, resulting in high processing costs.

Method used

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  • A kind of electroforming liquid used in K gold electroforming process
  • A kind of electroforming liquid used in K gold electroforming process
  • A kind of electroforming liquid used in K gold electroforming process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The formula of gold-copper binary K gold electroforming solution is as follows:

[0039]

[0040] According to the above formula as electroforming solution, the current density is 0.35A / dm 2 , The electroforming time is 16 hours, and the mirror K gold electroforming layer can be obtained with a thickness of 160 microns and a micro-Vickers hardness of 300HV. The mass fractions of the binary alloy are: gold 76%, copper 24%, and the color is bright rose gold.

Embodiment 2

[0042] The formula of gold-copper binary K gold electroforming solution is as follows:

[0043]

[0044] According to the above formula as electroforming solution, the current density is 0.38A / dm 2 , The electroforming time is 16 hours, and the mirror K gold electroforming layer is obtained, the thickness is 160 microns, the micro-Vickers hardness is 360HV, the mass fractions of the ternary alloy are: gold 75.6%, copper 24.4%, and the color is bright rose gold.

Embodiment 3

[0046] The formula of gold-copper binary K gold electroforming solution is as follows:

[0047]

[0048]

[0049] According to the above formula as electroforming solution, the current density is 0.46A / dm 2 , The electroforming time is 13.5 hours, and the mirror K gold electroforming layer can be obtained with a thickness of 165 microns and a micro-Vickers hardness of 369HV. The mass fractions of the binary alloy are: gold 59.5%, copper 40.5%, and the color is bright rose gold.

[0050] (4) Embodiment 4

[0051] The formula of gold-copper binary K gold electroforming solution is as follows:

[0052]

[0053] According to the above formula as electroforming solution, the current density is 0.49A / dm 2 , The electroforming time is 13.5 hours, and the mirror K gold electroforming layer can be obtained with a thickness of 165 microns and a micro-Vickers hardness of 368HV. The mass fractions of the binary alloy are: gold 58.8%, copper 41.2%, and the color is bright rose g...

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Abstract

The invention relates to electroforming liquid for a K gold electroforming process. The electroforming liquid comprises the following main components with one liter of solution as unit: 4-10 g / l of potassium aurous cyanide, 50-100 g / l of cuprous cyanide, 18-35 g / l of free potassium cyanide, 1-50 g of triethanolamine and 1-30 g / l of iminodiacetic acid as auxiliary complexing agents, 0.2-4 g / l of zinc sulfate as hardening agents, 10-30 g / l of dipotassium phosphate as buffering agents; the electroforming liquid for the K gold electroforming process is prepared through the components, and K gold products are electroformed; K gold is prepared through a gold and copper binary alloy electroforming process; the K gold electroforming liquid with stable performances is used for preparing hollow K gold products with low weights, high hardness, bright rose gold colors and bright and smooth surfaces; and the products have the advantages of low gold consumption, durability, three-dimensional and full shapes and low cost.

Description

technical field [0001] The invention relates to the technical field of metal electroforming, and more specifically refers to an electroforming liquid used in a K gold electroforming process. Background technique [0002] With the improvement of people's living standards, the demand for gold jewelry has far exceeded the traditional concept of gold preservation, and is becoming more artistic, personalized and popular. In this context, K gold jewelry has won a large market. At present, gold jewelry has realized the production of light and high hardness products by electroforming technology, which has saved a lot of gold consumption for the gold jewelry industry. However, the production of K gold jewelry is still mainly based on lost wax casting of gypsum molds. The disadvantages of this process are that the product is heavy, the style is flat, the surface is rough, and it is difficult to process, and the product price is high. [0003] The K gold products produced by the trad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/00
Inventor 罗翔
Owner 深圳市昊扬电铸技术开发有限公司
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