Nano micropore thermal-insulation board and production method thereof

Abstract

The invention discloses a nano micropore thermal-insulation board and a production method thereof. The nano micropore thermal-insulation board comprises fumed silica, diatomite, micron lithium oxide,reinforcing fibers and infrared radiation opacifying agent, wherein the reinforcing fibers comprises high-silica glass fibers and ceramic fiber cotton; the infrared radiation opacifying agent comprises silicon carbide and titanium dioxide. The production method includes the steps of S1, preparing materials according to the proportion; S2, feeding in a layered manner; S3 stirring and mixing; S4, performing compression molding; S5, packaging. The nano micropore thermal-insulation board is low in heat conduction coefficient, good in high-temperature stability and good in thermal-insulation performance.

Description

technical field [0001] The invention relates to the technical field of heat insulation board preparation, in particular to a nano-microporous heat insulation board and a preparation method thereof. Background technique [0002] Nanoporous materials originated in the early 1990s. At the International Materials Engineering Conference in 1992, the American scholar Hunt.A.J. proposed the concept of "Supper insulator". Since then, many scholars have successively used the concepts of "Supper insulator" or "High performance insulating material". Generally, super thermal insulation materials refer to thermal insulation materials whose thermal conductivity is lower than that of "non-convective air (still air)" under the intended use conditions. [0003] Nano-microporous board is also called "nano-porous super insulation board". It adopts nano-scale inorganic refractory powder and makes high-temperature resistant board through dry forming technology without adding gel material. Its...

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Problems solved by technology

[0006] Although this scheme makes the ceramic fiber heat insulation board have better high temperature resistance and flexural strength, its thermal conductivity at 1000°C ranges from 0.10-0.14W / (m K) in actual use, and the thermal conductivity The thermal conductivity of still air should be higher than 1000°C, and its thermal insulation performance is difficult to meet the thermal insulation needs of places with strict requirements on thermal insulation space and thickness; on the other hand, the ceramic fiber thermal insulation board is prepared by wet forming process. By mixing the powder material and the glue solution into a slurry, the wet ceramic fiber board is made by vacuum suction, and then dried, sintered and cooled to finally prepare the finished ceramic fiber heat insulation board

Wet process production will generate more wastewater, which increases environmental pressure and wastewater treatment costs. At the same time, wet billets need to be dried and sintered, resulting in a significant increase in energy consumption in the production process

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