Multi-layer film type high-sensitivity heat-sensitive temperature chip and manufacturing method thereof

Abstract

The invention relates to a multilayer thin-film type temperature-sensitive thermo-responsive chip with a high sensitivity. The temperature-sensitive thermo-responsive chip comprises a substrate, a ceramic body, and two metal end electrodes. The surface of the substrate is divided into a middle area and two end areas respectively arranged at two sides of the middle area. The ceramic body is arranged at the middle area. The two metal end electrodes are respectively arranged at the two end areas. The ceramic body is of a tortuous connected layered structure, which is formed by laminating N layersof ceramic films at intervals, wherein N is a natural number greater than or equal to 2. A metal film is arranged between each two adjacent ceramic films, and a metal film is arranged between the bottommost ceramic film and the substrate. Each metal film is only connected with one of the metal end electrodes. The invention further relates to a preparation method of the multilayer thin-film type temperature-sensitive thermo-responsive chip with the high sensitivity. According to the temperature-sensitive thermo-responsive chip, the small size, the low resistance value and the high B value canbe realized at the same time.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a multilayer film type high-sensitivity heat-sensitive temperature chip and a manufacturing method thereof. Background technique [0002] Such as figure 1 As shown, the traditional heat-sensitive temperature chip has a three-layer structure, including a porcelain body 1' and metal electrodes 2' respectively arranged on both surfaces of the porcelain body 1', and the metal electrodes 2' are usually silver electrodes. Such as figure 2 As shown, the preparation process of the traditional heat-sensitive temperature chip is: ceramic powder preparation → sintering ceramic ingots → slicing → printing metal electrodes → sintering metal electrodes. [0003] Traditional three-layer heat-sensitive temperature chip products often cannot achieve the purpose of low resistance and high B value while controlling the chip size due to the inherent resistivity and B value of the ce...

AI Technical Summary

Problems solved by technology

[0003] Traditional three-layer heat-sensitive temperature chip products often cannot achieve the purpose of low resistance and high B value while controlling the chip size due to the inherent resistivity and B value of the ceramic material itself, often low resistance The chip size of products with high B value will be very large, which cannot be used in some microcircuits and miniaturized production. At the same time, the excessively large chip size brings the disadvantage of slow response speed, which makes the chip unable to achieve high-sensitivity measurement.

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