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Grinding solution and preparation method thereof

A technology of grinding liquid and grinding sand, which is applied in chemical instruments and methods, and other chemical processes, can solve the problems of difficulty in ensuring the grinding quality of the grinding object and the decrease of grinding efficiency with the grinding time, so as to maintain the grinding efficiency and not reduce the efficiency Effect

Inactive Publication Date: 2019-04-16
东莞市希尔金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiments of the present invention provide a grinding liquid and a preparation method thereof, which are used to solve the problems existing in the prior art that the grinding efficiency becomes lower as the grinding time prolongs, and that it is difficult to ensure the grinding quality of the grinding object

Method used

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  • Grinding solution and preparation method thereof
  • Grinding solution and preparation method thereof
  • Grinding solution and preparation method thereof

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preparation example Construction

[0029] The invention also discloses a preparation method of grinding liquid, please refer to figure 1 , including the following steps:

[0030] S1. Weigh the following raw materials in parts by mass: 10% to 30% of grinding sand, 3% to 8% of antirust lubricant, 0.5% to 2% of flotation agent, 0.5% to 3% of wetting agent, 0.1 %~1% suspending agent, 56%~85.9% deionized water;

[0031] S2. Add the deionized water into the stirring container and stir at the first stirring speed; of course, the above-mentioned stirring container is preferably a stirring tank, and can also be a stirring container of other shapes, such as a stirring tank, a stirring bucket, a beaker, a flask Wait.

[0032] S3. Add the grinding sand into the stirring container under stirring at the first stirring speed, and form a uniform mixed solution with the deionized water;

[0033] S4. Add an anti-rust lubricant into the stirring container, and stir at a second stirring speed higher than the first stirring spee...

Embodiment 1

[0036] The embodiment of the present invention provides a grinding liquid, which is used in the process of batch processing of new silicon wafers or silicon wafers. The grinding liquid includes the following raw materials in parts by mass: 10% grinding sand, 3% anti-rust lubricant Agent, 0.5% flotation agent, 0.5% wetting agent, 0.1% suspending agent, 89.5% deionized water.

[0037] Wherein, the abrasive sand is silicon carbide with a particle size of 3-4 μm, the anti-rust lubricant is monoethanolamine ammonium borate, the flotation agent is octadecyl primary amine, and the wetting agent is sulfonated succinate Acid dioctyl sodium salt, the suspending agent is sodium carboxymethylcellulose.

[0038]The preparation method of described grinding liquid in the present embodiment, comprises the steps:

[0039] (1) Weigh the following raw materials in parts by mass: 10% silicon carbide with a particle size of 3 to 4 μm, 3% monoethanolamine ammonium borate, 0.5% octadecyl primary am...

Embodiment 2

[0045] The embodiment of the present invention provides a kind of grinding liquid, is used in the process of batch processing of novel silicon wafer or silicon wafer, and described grinding liquid comprises the raw material of following mass parts: 30% grinding sand, 8% antirust lubricating Agent, 2% flotation agent, 3% wetting agent, 1% suspending agent, 56% deionized water.

[0046] Wherein, the grinding sand is 4000 mesh alumina, the anti-rust lubricant is triethanolamine carboxylate, and the flotation agent is polyacrylamide; the wetting agent is polyoxyethylene ether glyceride and glycerin and The mixture of sorbitol, the mass ratio of polyoxyethylene ether glyceride to glycerin and sorbitol is 1:1:1; the suspending agent is sodium tripolyphosphate.

[0047] The preparation method of described grinding liquid in the present embodiment, comprises the steps:

[0048] (1) Take the following raw materials by mass parts: 30% of 4000 mesh alumina, 8% of triethanolamine carboxy...

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Abstract

The invention discloses a grinding solution and a preparation method thereof. The grinding liquid is used for batch processing of semi-conductor material chips of novel silicon wafers, silicon chips and the like. The grinding solution comprises, by weight, 10%-30% of grinding sands, 3%-8% of an anti-rusting lubricant, 0.5%-2% of a flotation reagent, 0.5%-3% of a moistening agent, 0.1%-1% of a suspending agent and 56%-85.9% of deionized water. The grinding liquid and the preparation method have the advantages that inorganic alkali is not needed, which is safe and protects the environment, the grinding efficiency is maintained under the condition that the performance of the grinding solution is not reduced, the grinding sands can uniformly act on the surfaces of the silica wafers or the silica chips in the grinding process, and therefore the long-term use of the grinding solution is achieved while the efficiency is not reduced.

Description

technical field [0001] The invention relates to the technical field of grinding material processing, in particular to a grinding liquid and a preparation method thereof. Background technique [0002] Silicon is a semiconductor material, and its own conductivity is not very good. To make silicon into a semiconductor material that conducts electricity well, it must be converted into wafers. Polysilicon is formed separately from many small single crystals with different crystal orientations and cannot be used for semiconductor circuits. Polysilicon must be melted into single crystals to be processed into wafers used in semiconductor applications. Processing to form silicon wafers involves doping, melting, cutting, grinding, etching and cleaning. In order to be able to print integrated circuits on silicon wafers and combine them closely with other components, the surface of silicon wafers must be straight. Higher and higher requirements have been put forward. [0003] Howeve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14
CPCC09K3/1463
Inventor 石及时张璐何俊才吴友壮康新
Owner 东莞市希尔金属材料有限公司
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