Phosphate glass laser cutting process

A phosphate glass, laser cutting technology, used in laser welding equipment, manufacturing tools, metal processing equipment, etc., to solve the uneven strength, improve the effect of expansion lines, and ensure the effect of chemical stability

Active Publication Date: 2019-04-16
UNIONLIGHT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a phosphate glass laser cutting process to solve the problems existing in the prior art

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  • Phosphate glass laser cutting process
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Embodiment Construction

[0017] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0018] The invention provides a phosphate glass laser cutting process, comprising the following steps:

[0019] (1) Set an appropriate depth of cut to ensure that the fault is centered;

[0020] (2) Use a low-power laser to make dots at the location of the fault;

[0021] (3) Normal cutting with proper power;

[0022] Preferably, the laser cutting parameters include: laser, power or angle, pulse number, cutting times, cutting depth or feed, cutting speed, frequency, and rounds. figure 1 and figure 2 The laser cutting parameters of the two models are given, and the laser cutting parameters can be adjusted appropriately for different cutting materials and models.

[0023] Preferably, the laser is a 1064nm frequency-doubled 532nm laser ...

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Abstract

The invention discloses a phosphate glass laser cutting process. The process comprises the following steps that (1), the position of a cutting section is enabled to be centered by adjusting laser cutting parameters; (2) in the centered cutting layer position, small-power laser is used for dotting; and (3), proper power is used for normal cutting. According to the phosphate glass laser cutting process, the laser cutting parameters are set, so that the product is cut into a good cutting section (the cutting layer is centered, and extension lines are controlled to be within 30 microns) and planeeffect, so that the problem that the strength of different surfaces of a glass sheet is uneven due to the fact that the cutting effect of a traditional cutting section is not centered is solved.

Description

technical field [0001] The invention relates to the technical field of phosphate glass material cutting, in particular to a phosphate glass laser cutting process. Background technique [0002] Phosphate glass material, which is different from fluorophosphate-based blue glass, has irreplaceable advantages including high strength, environmental protection, and better cut-off performance in the near-infrared band (700-1100nm). [0003] At present, the electronics industry has higher and higher requirements for the quality of electronic products, and higher requirements for clean appearance, high strength, and chemical stability. At the same time, the requirements for cutting small pieces of glass are also more stringent. Module manufacturers not only require good plane cutting effects, but also begin to control the effect of cutting sections, and the requirements are gradually tightened. [0004] In recent years, most of the cutting methods of glass materials in the optical fi...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/402
CPCB23K26/402
Inventor 裴广庆王丹柳祝平王有明
Owner UNIONLIGHT TECH
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