Thick-copper copper substrate etching process
A copper substrate and process technology, applied in the field of PCB production, can solve the problems of poor precision, high hole processing cost, and inability to process special-shaped through holes, etc., to achieve the effect of reducing processing cost, improving production efficiency and production quality
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[0024] The invention discloses a pitting process for a thick copper copper substrate, which includes the following steps:
[0025] (1) Cutting: Cut thick copper and copper substrates to 10 sizes according to product requirements.
[0026] (2) Grinding: Grinding the thick copper-copper substrate 10 to appropriately increase the roughness of the surface of the thick copper-copper substrate 10 while cleaning the surface. In this embodiment, during the grinding process, the size of the wear scar is controlled to be 12-16mm, the mass concentration of pozzolan used is 15-25%, the temperature is controlled at 80-90°C, and the speed is controlled at 2.0-2.5m / min.
[0027] (3) Film sticking: sticking resist ink or dry film 20 on the surface of the thick copper-copper substrate 10 . In this embodiment, the film sticking is carried out at a temperature of 110-130° C., and the speed is controlled at 1.2-1.4 m / min.
[0028] (4) Exposure: the image is transferred to the resist ink or dry ...
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