Electrostatic Controllable Abrasive Flow Machining Method Based on Charge Tip Aggregation Effect

Abstract

The invention discloses a static electricity controllable abrasive particle flow processing method based on a charge tip aggregation effect. An abrasive particle flow with non-electrolyte as a carrieris subjected to a high-voltage electrostatic field to be charged, so that the distribution of the abrasive particles in the flow field can be controlled, and negative influences produced by abrasiveparticle size unevenness and large-particle-size abrasive particles in the processing process are reduced; an electric field is applied to the flow field, the distribution characteristics of the abrasive particles with the negative charge on the collision area on the surface of a workpiece with the positive charge are changed through the electric charge tip aggregation effect, the possibility of collision of the abrasive particles to the microscopic surface crest of the workpiece is increased, workpiece surface crest removal is accelerated, the flow-in angle of the abrasive particles is periodically swung in a pulse mode, the optimal polishing alternating force acting on the workpiece is obtained by effectively adjusting and controlling the pulse frequency and the swing angle, and it is ensured that the high-quality surface is obtained on the premise of efficient removal.

Description

technical field [0001] The invention relates to the technical field of ultra-precision machining, and is suitable for surface grinding and polishing of workpieces such as optical elements and amorphous film substrates. More specifically, it relates to an electrostatic controllable abrasive particle flow processing method based on the effect of charge tip aggregation . Background technique [0002] Nano-film materials have always been a hot field of scientific research in the world, because of their unique surface effects, volume effects, quantum size effects and macroscopic quantum tunnel effects, etc., and reflect various strange forces, electricity, light, magnetism, Thermal effect and chemical activity, so it has broad application prospects in the fields of microelectronics, optics, energy and so on. The substrate (such as single crystal silicon, silicon carbide, etc.) is an indispensable material in the preparation process of nanometer thin films, and plays an important...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the shortcomings of existing processing such as low processing efficiency, low resource utilization rate, and difficulty in improving processing quality, and provides an electrostatic controllable abrasive flow processing method based on the charge tip aggregation effect, which is suitable for optical Precision automatic grinding and polishing of workpiece surfaces such as components and amorphous film substrates

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