Ceramic-based vertical micro-thin probe-card connecting opening MVW structure

A probe card, ceramic-based technology, applied in the direction of measuring devices, instruments, measuring electricity, etc., can solve the problems of unrepairable vertical probe card connection structure, large PAD spacing, low test frequency, etc., and achieve high current and high frequency. The test requirements, the short circuit distance, and the short production cycle effect

Active Publication Date: 2019-03-19
无锡旺矽科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic-based vertical micro-probe card connection port MVW structure, which reasonably solves the problem that the vertical probe card connection structure in...

Method used

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  • Ceramic-based vertical micro-thin probe-card connecting opening MVW structure
  • Ceramic-based vertical micro-thin probe-card connecting opening MVW structure
  • Ceramic-based vertical micro-thin probe-card connecting opening MVW structure

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Embodiment Construction

[0020] Through the following description of the embodiments, it will be more helpful for the public to understand the present invention, but the specific embodiments given by the applicant cannot and should not be regarded as limitations on the technical solutions of the present invention, any components or technical features Changes to the definition and / or formal but not substantive changes to the overall structure should be regarded as the scope of protection defined by the technical solutions of the present invention.

[0021] Example:

[0022] Such as Figure 1-Figure 3 The MVW structure of a ceramic-based vertical micro-probe card connection port shown includes a reinforcing board 1, a PCB main board 2, a grounding board 3, a ceramic substrate 4, a power board 5, a micro-drilling hole 6, a fine metal wire 7, and a ring Oxygen Resin 8, PPS1 Power Contact 9, PPS2 Power Contact 10, Grounding Contact 11, Signal Contact 12, Contact Plating 13, Copper Plating 14, Nickel Plati...

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PUM

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Abstract

The invention discloses a ceramic-based vertical micro-thin probe-card connecting opening MVW structure. The ceramic-based vertical micro-thin probe-card connecting opening MVW structure comprises a reinforcement plate, a PCB mainboard, a grounding plate, a ceramic substrate, a power board, a micro drilling hole, a micro-thin metal wire, epoxy resin, PPS1 power contacts, PPS2 power contacts, grounding contacts, signal contacts, a contact plating, a copper plating, a nickel plating, a gold plating, a vertical probe card head, a probe and the like; the ceramic-based vertical micro-thin probe-card connecting opening MVW structure is characterized in that the vertical probe-card connecting system MVW structure is small in whole connecting base size, short in making period and low in cost; thelarge-current high-frequency test requirement can be met, and the reliability is improved. The vertical probe card head is in direct mechanical connection with the PCB mainboard, the circuit distanceis short, the transmission speed is high, the frequency is high, simple assembling is achieved, the structure can be reused, and can also be repaired after abrasion, contact portions are polished andsubjected to gold plating anew, and repairing is convenient and fast and easy and convenient; the defects of the prior art are overcome.

Description

technical field [0001] The invention relates to the technical field of circuit board connection, in particular to a ceramic-based vertical micro-probe card connection interface MVW structure. Background technique [0002] The vertical probe card connection methods in the prior art are all connected by MLC, MLO or flying wires (NORMAL Concept), not only the production cycle is long, the design and production need 10 to 12 weeks, which seriously affects the progress of the project, the cost is high and it needs to be imported , the price is between 25,000 and 50,000 US dollars, and it cannot be repaired. Special equipment is required for assembly. The maximum current can only be below 300mA, and the resistance is large. The PAD coating is thin, only below 1UM, which greatly affects the life. It can only achieve 100μm, and the test frequency can only be achieved within 200Mhz due to the long line. The flying wire connection method (NORMAL Concept) requires the application of c...

Claims

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Application Information

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IPC IPC(8): G01R1/073
CPCG01R1/07307
Inventor 梅森
Owner 无锡旺矽科技有限公司
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