Copper-based nickel plating-gold plating layer waste plating piece metal gradient recovery method

Abstract

The invention belongs to the technical field of waste recycling and discloses a copper-based nickel plating-gold plating layer waste plating piece metal gradient recovery method. The method comprisesthe following steps of 1, putting plating pieces into ethyl alcohol to conduct cleaning to remove surface greasy dirt and then conducting cleaning through deionized water; 2, conducting gold solutiontreatment on the cleaned plating pieces; 3, conducting nickel solution treatment on the plating pieces subjected to gold solution treatment; 3.1, washing the surfaces of the plating pieces subjected to gold solution treatment through deionized water. Through the copper-based nickel plating-gold plating layer waste plating piece metal gradient recovery method, reaction is controllable; a gold plating layer on the outermost side of a base body can be quickly and selectively removed in priority, corrosion dissolution to a metallic nickel layer under the gold plating layer is small, and the purpose of separating and recycling metallic gold is achieved; the metallic nickel layer on the surface of each degolded plating piece is selectively separated and recycled; and finally, selective separation and recycling of gold, nickel and copper in the plating pieces are realized.

Description

technical field [0001] The invention belongs to the technical field of recycling waste materials, and in particular relates to a method for recovering metals from waste plated parts with a copper-based nickel-gold plating layer in a gradient manner. Background technique [0002] As a surface treatment technology, electroplating is widely used in the manufacturing process of electrical components, electronic equipment, communication equipment and instruments to improve the technical parameters and performance of devices; in order to meet certain specific technical performance requirements while saving rare and precious metals Resources, the surface of the device substrate is often plated with multiple layers of metal; after a long period of use, the replaced old or damaged plating, as a precious and enriched resource, needs to be separated and recycled from the plating layer and the substrate metal to achieve a certain degree of economy value and resource sustainable utilizat...

AI Technical Summary

Problems solved by technology

[0002] As a surface treatment technology, electroplating is widely used in the manufacturing process of electrical components, electronic equipment, communication equipment and instruments to improve the technical parameters and performance of devices; in order to meet certain specific technical performance requirements while saving rare and precious metals Resources, the surface of the device substrate is often plated with multiple layers of metal; after a long period of use, the replaced old or damaged plating, as a precious and enriched resource, needs to be separated and recycled from the plating layer and the substrate metal to achieve a certain degree of economy value and resource sustainable utilization; in the traditional deplating recovery technology, the method of deplating mainly adopts mixed acid system, aqua regia system, cyanide system or electrolysis; the above mixed acid system and aqua regia system have strong acidity or oxidative properties, making it difficult to control the dissolution and separation process, which can easily cause serious dissolution of multi-layer coatings and substrates, and cannot achieve effective separation and recovery between coatings and between coatings and substrates, resulting in high cost of waste liquid treatment; cyanide The chemical system is highly toxic and extremely dangerous to operate, which poses a serious threat to workers and the environment; electrolytic deplating technology has high requirements for equipment and control, and increases operating costs, reducing the economic profit of the enterprise