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Dissolvable printing ink, method for protecting surface of used material through dissolvable printing ink during brazing process and application of dissolvable printing ink

An ink and vinyl resin technology, applied in the field of dissolvable ink, can solve the problems of complicated and complicated preparation process, difficult to commercialize, consuming manpower and financial resources, etc., and achieves the effects of convenient construction, prevention of stains or spots, and low price.

Inactive Publication Date: 2019-03-15
CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The raw materials used in the preparation method include more than ten kinds of raw materials such as methyl methacrylate, butyl acrylate, acrylic acid, hydroxypropyl acrylate, isooctyl methacrylate, diisocyanate and azobisisobutyronitrile, and the preparation process is loaded down with trivial details. And the diisocyanate used also has safety risks and is not easy to commercialize; patent CN 107446258 A discloses a strippable resin and its preparation method and application
The resin combines soft PVC with good film-forming properties and acid and alkali resistance and polyester with low price and simple preparation process and good adhesion to obtain a peelable resin. The preparation method is simple and easy to operate, and the protective coating film formed by the resin Acid and alkali resistance, short-term water and oil resistance, but the coating needs to be peeled off by hand after protection, which consumes manpower and financial resources

Method used

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  • Dissolvable printing ink, method for protecting surface of used material through dissolvable printing ink during brazing process and application of dissolvable printing ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Take 12.42g gamma-butyrolactone, 4.2g polyethylene acetate resin, 2.1g trioctyl trimellitate, 1.2g polytetrafluoroethylene wax, 1.0g quartz powder, 0.0164g phthalocyanine blue, mix them at high speed Disperse and stir for 20 minutes with a disperser, then completely homogenize through a three-roller mill, screen-print on the object to be used, and place it in a blast drying oven at 150°C for about 10 minutes to completely solidify to form a coating.

[0039] The coating exhibits good resistance to nickel / gold plating. The coating in this experimental example is put into a pre-configured heated chemical nickel plating solution (85°C), soaked in the chemical gold plating solution (90°C) 30min, 10min washing and air-drying, no swelling, peeling and discoloration of the film layer occurred through visual inspection, and there was no nickel / gold penetration on the surface of the circuit board after the film was removed.

[0040] The coating can withstand 5 minutes at 170°C, ...

Embodiment 2

[0043] Take 11.42g gamma-butyrolactone, 4.2g polyvinyl chloride resin, 2.2g trioctyl trimellitate, 1.2g polytetrafluoroethylene wax, 1.0g quartz powder, 0.0164g phthalocyanine blue, mix them in a high-speed disperser Disperse and stir for 20 minutes, then pass through a three-roll mill to completely homogenize, screen-print on the object to be used, and place it in a blast drying oven at 150°C for about 5 minutes to completely solidify to form a coating.

[0044] The coating exhibits good resistance to nickel / gold plating. The coating in this experimental example is put into a pre-configured heated chemical nickel plating solution (85°C), soaked in the chemical gold plating solution (90°C) 30min, 10min washing and air-drying, no swelling, peeling and discoloration of the film layer occurred through visual inspection, and there was no nickel / gold penetration on the surface of the circuit board after the film was removed.

[0045] The coating can withstand 5 minutes at 170°C, no...

Embodiment 3

[0048] Take 13.42g γ-butyrolactone, 4.5g polyvinyl acetate, 2.0g dimethyl phthalate, 1.1g polytetrafluoroethylene wax, 1.1g quartz powder, 0.0164g phthalocyanine blue, mix and disperse at high speed Machine dispersion and stirring for 20 minutes, and then completely homogenized by a three-roller mill, screen printed on the object to be used, and placed in a blast drying oven at 150°C for about 5 minutes to completely solidify to form a coating.

[0049] The coating exhibits good resistance to nickel / gold plating. The coating in this experimental example is put into a pre-configured heated chemical nickel plating solution (85°C), soaked in the chemical gold plating solution (90°C) 30min, 10min washing and air-drying, no swelling, peeling and discoloration of the film layer occurred through visual inspection, and there was no nickel / gold penetration on the surface of the circuit board after the film was removed.

[0050] The coating can withstand 5 minutes at 170°C, and the film...

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Abstract

The invention discloses dissolvable printing ink, a method for protecting the surface of a used material through the dissolvable printing ink during a brazing process and application of the dissolvable printing ink. The printing ink comprises the following components in parts by weight: 5 to 45 parts of vinyl resin, 2 to 18 parts of a plasticizer, 2 to 12 parts of a release agent, 1 to 7 parts ofa filler, 0.02 to 0.8 part of a pigment, and 25 to 95 parts of a solvent. The dissolvable printing ink has the advantages that all components have good compatibility, the dissolvable printing ink canbe coated to not only the surface of the used material through silk-screen printing, but also the surface of the used material through dip soldering or brushing, and formed coating can endure high temperature and corrosive chemicals in a soldering flux. The printing ink has excellent nickel plating / gold plating chemical resistance performance, and sufficient strength and adhesion, can prevent contaminating or speckling during the brazing process, is applicable to performing of selective coverage on a PCB board in a PCB board chemical nickel-plating / cold-plating technology, and can endure severe temperature and corrosion conditions for typical dipping.

Description

technical field [0001] The invention relates to a soluble ink, in particular to the technical field of manufacturing printed circuit boards, which are substrates for installation and connection of electronic components, in particular to a soluble ink for circuit boards resistant to nickel / gold plating solutions, and Method and application of surface brazing process protection for objects. Background technique [0002] With the continuous development of instruments, meters, electronics, machinery, automobiles, construction and other industries, it is necessary to temporarily protect the surface of the product in a specific process or time to facilitate the transportation, storage, reprocessing and assembly of the product. Protects against wear, contamination, corrosion and mechanical scratches. Traditional temporary protection measures are generally wax paper, wrapping plastic film, direct waxing, self-adhesive, etc., but these methods have various shortcomings, such as poor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/106C09D11/03H05K3/28
CPCC09D11/03C09D11/106H05K3/28H05K3/285
Inventor 肖忠良刘青吴道新夏妮曾鹏曾超曹忠
Owner CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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