Epoxy resin composite board for vacuum plastic film mold

An epoxy resin and vacuum suction technology, which is applied in the field of epoxy resin composite panels for vacuum suction film molds, can solve problems such as easily affecting the shape of the vacuum suction film, easy deformation of aluminum alloys, and changes in the shape of the mold, etc. The effect of reducing the frequency of installation and maintenance, not easy to deform, and reducing the frequency of replacement

Active Publication Date: 2020-11-20
东莞市艾博龙新型材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional molds are usually made of aluminum alloy, which is prone to deformation under high temperature conditions, which causes the shape of the mold to change, which in turn easily affects the shape of the vacuum plastic film, and at the same time shortens the service life of the mold. still room for improvement

Method used

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  • Epoxy resin composite board for vacuum plastic film mold
  • Epoxy resin composite board for vacuum plastic film mold
  • Epoxy resin composite board for vacuum plastic film mold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] An epoxy resin composite board for a vacuum blister film mold, comprising the following components in parts by mass:

[0043]93 parts of E-55 epoxy resin; 16 parts of curing agent; 15 parts of polyamideimide; 0.5 parts of defoamer.

[0044] In this embodiment, the curing agent is T31 curing agent.

[0045] In this embodiment, the defoamer is emulsified silicone oil.

[0046] The preparation method of epoxy resin composite board is as follows:

[0047] (1) In a 200L reactor, under normal temperature conditions, add 93kg of E-55 epoxy resin and stir at a speed of 40r / min;

[0048] (2) Add 16kg of T31 curing agent, 15kg of polyamideimide, and 0.5kg of emulsified silicone oil while stirring;

[0049] (3) After stirring and mixing uniformly, the uniformly mixed mixture is poured onto a mold to obtain an epoxy resin composite board.

Embodiment 2

[0051] An epoxy resin composite board for a vacuum blister film mold, comprising the following components in parts by mass:

[0052] 108.5 parts of E-51 epoxy resin; 18.5 parts of curing agent; 17.5 parts of polyamideimide; 0.55 parts of defoamer.

[0053] In this embodiment, the curing agent is T32 curing agent.

[0054] In this embodiment, the defoamer is polyoxyethylene polyoxypropanolamine ether.

[0055] The preparation method of epoxy resin composite board is as follows:

[0056] (1) In a 200L reactor, under normal temperature conditions, add 108.5kg of E-51 epoxy resin and stir at a speed of 40r / min;

[0057] (2) Add 18.5kg of T32 curing agent, 17.5kg of polyamideimide, and 0.55kg of polyoxyethylene polyoxypropanolamine ether while stirring;

[0058] (3) After stirring and mixing uniformly, the uniformly mixed mixture is poured onto a mold to obtain an epoxy resin composite board.

Embodiment 3

[0060] An epoxy resin composite board for a vacuum blister film mold, comprising the following components in parts by mass:

[0061] 124 parts of E-44 epoxy resin; 21 parts of curing agent; 20 parts of polyamideimide; 0.6 parts of defoamer.

[0062] In this embodiment, the curing agent is T33 curing agent.

[0063] In this embodiment, the defoaming agent is polyoxypropylene oxide ethylene glyceryl ether.

[0064] The preparation method of epoxy resin composite board is as follows:

[0065] (1) In a 200L reactor, under normal temperature conditions, add 124kg of E-44 epoxy resin and stir at a speed of 40r / min;

[0066] (2) Add 21kg of T32 curing agent, 20kg of polyamideimide, and 0.6kg of polyoxypropylene oxide glyceryl ether while stirring;

[0067] (3) After stirring and mixing uniformly, the uniformly mixed mixture is poured onto a mold to obtain an epoxy resin composite board.

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Abstract

The invention relates to the technical field of vacuum plastic film moulds, and provides an epoxy resin composite board for a vacuum plastic film mould so as to solve the problem that the surface of aplastic board is not resistant to high temperature. The epoxy resin composite board comprises the following components in parts by mass: 93-124 parts of epoxy resin, 16-21 parts of a curing agent, 15-20 parts of polyamideimide and 0.5-0.6 part of a defoamer, wherein the epoxy resin is bisphenol A-type epoxy resin and comprises one or more of bisphenol A-type epoxy resin, epoxy resin comprises E-51 epoxy resin, E-55 epoxy resin and E-44 epoxy resin. Through addition of the polyamideimide, due to high heat deformation temperature and high tensile strength of the polyamideimide, improvement on the temperature resistance and the deformation resistance of the epoxy resin composite board is facilitated, so that the heat deformation temperature and the tensile strength of the epoxy resin composite board are enhanced, the prepared vacuum plastic film mould is not easily deformed, and thus reduction in the frequency of mould replacement is facilitated and the production cost is lowered.

Description

technical field [0001] The invention relates to the technical field of vacuum plastic film moulds, more specifically, it relates to an epoxy resin composite board for vacuum plastic film molds. Background technique [0002] Vacuum blister film is a film made of PVC with a honeycomb mesh structure in cross-section. It is mainly used for surface packaging of various panels. It is also called decorative film and adhesive film. It is widely used in building materials, packaging, Medicine and many other industries. [0003] Vacuum plastic film pressing is usually carried out under high temperature conditions, therefore, vacuum plastic film molds generally need to be in a high temperature environment for a long time. However, traditional molds are usually made of aluminum alloy, which is prone to deformation under high temperature conditions, which causes the shape of the mold to change, which in turn easily affects the shape of the vacuum plastic film, and at the same time short...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L79/08C08K7/28
CPCC08L63/00C08L79/08C08K7/28
Inventor 艾友德
Owner 东莞市艾博龙新型材料有限公司
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