Processing method for copper target

Abstract

The invention provides a processing method for a copper target. The processing method comprises the following steps: providing the copper target, an aluminum alloy disc cutter and a diamond disc cutter; and subjecting the surface of the copper target to rough processing with the aluminum alloy disc cutter and to finish processing with the diamond disc cutter. According to the invention, through processing to the surface of the copper target by utilization of the aluminum alloy disc cutter, the processing allowance on the surface of the copper target used as a blank can be rapidly removed, andthe copper target blank can obtain a shape approximate to the shape of a final copper target used for sputtering, while the aluminum alloy disc cutter is insusceptible to being damaged, so the machining efficiency of the copper target can be improved; and through processing to the surface of the copper target by utilization of the diamond disc cutter, the surface of the copper target can be further processed and is brighter and cleaner, and the copper target is avoided from generating deformation, so the requirements of sputtering are met. Compared with the prior art, the processing method provided by the invention improves the processing efficiency of the copper target, avoids the copper target from generating deformation, and improves the qualified processing rate of the copper target.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for processing a copper target. Background technique [0002] In the vacuum sputtering process, the target is used as a sputtering source, and a large number of target atoms are sputtered under the bombardment of electrons and argon atoms, and the target atoms are deposited on the substrate to achieve the purpose of coating. In the prior art, a copper target is a commonly used target in the vacuum sputtering process. [0003] Copper targets need to be processed before they are used as sputtering sources so that they have proper parallelism and surface roughness. In the process of copper target processing, it is usually hoped to reduce processing time and improve processing efficiency on the premise of processing qualified copper targets suitable for sputtering. However, since the copper target usually has a larger area and a thinner thickness, it is...

AI Technical Summary

Problems solved by technology

However, since the copper target usually has a larger area and a thinner thickness, it is prone to deformation during processing, resulting in an uneven sputtering surface of the copper target, which affects the quality of the film on the substrate during the sputtering process.

[0004] Therefore, in the prior art, copper targets are usually difficult to balance between processing efficiency and pass rate

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