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Batch transfer device and transfer method for microchip

A transfer device and chip technology, applied in transportation and packaging, conveyor objects, furnaces, etc., can solve problems such as efficiency, yield and transfer accuracy, and practical application obstacles.

Active Publication Date: 2019-01-22
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a microchip batch transfer device and transfer method to solve the problem of efficiency, yield and transfer accuracy in the process of transferring microchips to circuit substrates in batches in the prior art. Poor, a technical problem that brings huge obstacles to practical application

Method used

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  • Batch transfer device and transfer method for microchip
  • Batch transfer device and transfer method for microchip
  • Batch transfer device and transfer method for microchip

Examples

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Embodiment 1

[0036] Embodiments of the present invention provide a batch transfer device for microchips. see figure 1 , the batch transfer device for microchips specifically includes: a loading mold 100, the loading mold 100 includes a loading area 101 and a non-loading area 102 located at the edge of the loading area 101; a plurality of chip suction holes arranged in an array formed on the loading area 101 1011; the outer cover 200 formed on the non-loading area 102, the cavity 201 is formed between the outer cover 200 and the loading mold 100; the air suction holes 202 and the inflation holes 203 formed on the outer cover 200; The input port 301 is sealedly connected to the air suction hole 202 for extracting the gas in the chamber 201 ; the inflator 400 , the output port 401 of the inflator 400 is sealedly connected to the inflation hole 203 for inflating the chamber 201 .

[0037] Through high-precision equipment, a large number of microchips are arranged on the target substrate or ci...

Embodiment 2

[0048] Based on the same concept as the above-mentioned embodiments, the embodiments of the present invention provide a batch transfer method for microchips, see image 3 , the method steps are as follows:

[0049] Step 110 , providing a sample stage on which a plurality of microchips arranged in an array are placed.

[0050] see Figure 4 , a sample stage 500 is provided, and a plurality of microchips 501 arranged in an array are placed on the sample stage 500 .

[0051] In this embodiment, the micro chip is exemplarily a micro light emitting diode chip. The specific preparation method of the miniature light-emitting diode chip can use metal organic chemical vapor deposition, deposit a gallium nitride GaN epitaxial layer on a clean sapphire substrate, and the epitaxial layer includes but is not limited to n-type GaN epitaxial layer, multiple quantum well layer, p-type GaN layer The epitaxial layer is made by lithography, cleaning, etching, electrode deposition and other ch...

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Abstract

The embodiment of the invention discloses a batch transfer device and a transfer method of a microchip. The batch transfer device comprises a loading mold which comprises a loading area and a non-loading area located at the edge of the loading area. A plurality of chip adsorption holes formed in an array arrangement on the mounting region; An outer cover formed on the non-loading area, a chamber formed between the outer cover and the loading mold; An air suction hole and an air charging hole formed on the outer cover; An air suction device, wherein an input port of the air suction device is sealingly connected with the air suction hole for extracting gas from the chamber; An outlet of the inflation device is sealingly connected to the inflation hole for inflating the chamber. The technicalproposal provided by the embodiment of the invention achieves the purpose of accurately controlling the air pressure in the chamber by pumping and inflating the chamber formed between the outer coverformed on the non-loading area and the loading mold, and greatly improves the accuracy of bulk transfer of a large amount of microchips to be transferred.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor displays, and in particular, to a batch transfer apparatus and transfer method for microchips. Background technique [0002] Transferring the prepared huge number of microchips to the same circuit substrate can improve the integration degree of the chips on the circuit substrate, so as to improve the performance of the circuit substrate provided with the huge number of microchips. [0003] Exemplarily, a micro-LED (Micro-LED) display panel is a micro-LED chip with a thin-film, miniaturized, and arrayed LED chip structure design, and a CMOS integrated circuit process is used to make a drive circuit to realize each pixel point. Addressing control and individually driven display technology. Micro-LED display panels have various advantages such as self-illumination, simple structure, small size and energy saving. Compared with traditional LCD display panels and OLED displa...

Claims

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Application Information

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IPC IPC(8): H01L21/677B65G49/05B65G49/07
CPCB65G49/05B65G49/07H01L21/67721H01L21/67763H01L21/67766
Inventor 程鑫刘召军罗冰清陈日飞
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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