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A preparation method of a printed circuit board

A printed circuit board and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, transfer printing, etc., can solve the problem of not being able to obtain high-quality circuit boards, and achieve guaranteed service life, good conductivity, and good quality Effect

Inactive Publication Date: 2019-01-11
安徽银点电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the technical problem to be solved by the present invention is to provide a method for preparing printed circuit boards, which solves the problem that the existing production methods cannot obtain high-quality circuit boards

Method used

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] An embodiment of the present invention provides a method for preparing a printed circuit board, comprising the following steps:

[0026] a, material selection, selecting a circuit substrate, the circuit substrate includes an internal substrate to wrap a composite layer around the substrate, and the substrate is a rectangular polyimide glass fiber substrate;

[0027] b. To prepare a composite silver paste, the silver powder and additives are mixed and heated and mixed at 500-1000°C;

[0028] c, circuit board draw...

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Abstract

The invention provides a preparation method of a printed circuit board, comprising the following steps: a, selecting material and selecting circuit substrate; B, preparing composite silver paste; C, manufacture that circuit board drawing; D, manufacture of copper foil plate; (e) prin that circuit substrate drawing; F. Circuit board copying. The preparation method of the printed circuit board disclosed by the invention adopts the circuit of printing high-temperature silver paste on the substrate firstly, after four times of composite silver paste, screen printing and high-temperature and cooling treatment, the prepared circuit board and the silver paste circuit have good electrical conductivity, are insulated from the internal substrate, the silver paste is difficult to fall off and the quality of the circuit board is good. Then the copper foil circuit is compounded on the circuit board, and the double-layer circuit path is carried out, so that the circuit board has high quality and thedouble-layer path guarantees the service life of the circuit board.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a preparation method of a printed circuit board. Background technique [0002] With the development of circuit board manufacturing technology, the current circuit has become a necessity of modern people's life, and since the multi-layer circuit board can integrate complex circuits in electronic products, it has been widely used in electronic products. In addition, multi-layer circuit boards can be mass-produced with printing technology, simplifying the manufacturing process, so they are an indispensable link in the electronic product chain. [0003] However, in the production process of current multi-layer circuit boards, plastic materials are generally used as the substrate, and then conductive materials are screen-printed, and then multi-layer composites are performed at a low temperature. This operation method is simple, but the Due to the limitation of production technol...

Claims

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Application Information

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IPC IPC(8): H05K3/20
CPCH05K3/202H05K2203/0531
Inventor 冯婉钰冯明铎张家植
Owner 安徽银点电子科技有限公司
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