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A kind of bismuth-based alloy solder paste composition

A composition and alloy technology, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems of poor corrosion resistance, poor oxidation resistance, process performance and welding performance can not be satisfied at the same time, to achieve enhanced strength and corrosion resistance, the effect of enhancing the oxidation resistance

Active Publication Date: 2021-04-30
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There is a contradiction between the solderability and stability of ordinary solder paste, resulting in that the process performance and soldering performance cannot be satisfied at the same time
[0004] The quality of tin alloy powder directly affects the quality of solder paste. At present, the tin alloy powder on the market still has the following problems, such as poor oxidation resistance, high brittleness, insufficient toughness, easy vibration failure, and poor corrosion resistance. Therefore, , there is an urgent need in this field to develop a new type of solder paste composition that is environmentally friendly, corrosion-resistant, strong in oxidation resistance, excellent in stability and reliability, and has excellent performance

Method used

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  • A kind of bismuth-based alloy solder paste composition
  • A kind of bismuth-based alloy solder paste composition
  • A kind of bismuth-based alloy solder paste composition

Examples

Experimental program
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preparation example Construction

[0068] In order to solve the above problems, a second aspect of the present invention provides a method for preparing a bismuth-based alloy solder paste composition, the preparation method comprising the following steps:

[0069] A1: Preparation of tin alloy powder;

[0070] A2: Preparation of soldering paste: Mix rosin, solvent, thickener, activator, corrosion inhibitor and protective agent in the formula, heat until dissolved, stir evenly, and cool to room temperature to obtain soldering paste;

[0071] A3: Preparation of the bismuth-based alloy-containing solder paste composition: mix the solder paste and tin alloy powder in proportion to obtain the bismuth-based alloy-containing solder paste composition.

[0072] During the whole preparation process, there is no limit to the heating temperature and time, the purpose is to dissolve, and there is no limit to the stirring time and stirring speed, the purpose is to stir evenly, and the room temperature refers to 20±5°C.

[00...

Embodiment 1

[0099] The first aspect of Example 1 provides a bismuth-based alloy-containing solder paste composition, including solder paste and tin alloy powder, and the weight ratio of the solder paste to the tin alloy is 12%.

[0100] In terms of weight percentage, tin alloy powder contains:

[0101] Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr 0.65%, In 0.35%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1.

[0102] In terms of parts by weight, the solder paste contains the following components:

[0103] 35 parts of rosin, 35 parts of solvent, 8 parts of thickener, 6 parts of active agent, 3 parts of corrosion inhibitor and antioxidant and 3 parts of protective agent. The rosin is selected from disproportionated rosin; the solvent is selected from the combination of tetraethylene glycol methyl ether and tripropylene glycol methyl ether in parts by weight; the thickener is selected from palm wa...

Embodiment 2

[0118] The first aspect of Example 2 provides a bismuth-based alloy-containing solder paste composition, including solder paste and tin alloy powder, and the weight ratio of the solder paste to tin alloy is 12%.

[0119] In terms of weight percentage, tin alloy powder contains:

[0120] Ag 3%, P 0.02%, RE 40%, Co 1%, Pd 2%, Bi 0.4%, Mg 0.05%, Al 0.05%, Cu0.8%, Zr 0.5%, In 0.3%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1.

[0121] The composition of the flux paste is the same as in Example 1. The preparation method of the protective agent is the same as in Example 1.

[0122] The second aspect of Example 2 provides a preparation method of a bismuth-based alloy-containing solder paste composition, the preparation method is the same as that of Example 1, and the preparation method of the tin alloy is also the same as that of Example 1.

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Abstract

The invention provides a bismuth-based alloy solder paste composition, which comprises solder flux and tin alloy powder, and the weight ratio of the solder flux to tin alloy powder is 9%-15%. The inventor added a protective agent to the soldering paste, which can form a protective film to prevent the precipitation of small molecules. During the soldering process, high temperature leaves holes to absorb small molecules, so as to avoid harm to the human body and the environment. The solder paste prepared by the invention is environmentally friendly, has excellent performance, strong oxidation resistance, is lead-free, and has excellent expansion performance and soldering performance.

Description

technical field [0001] The invention relates to the field of solder paste, in particular to a bismuth-based alloy solder paste composition. Background technique [0002] Solder paste, also called solder paste, is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, solder paste, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. [0003] There is a contradiction between the solderability and stability of common solder pastes, resulting in that the process performance and soldering performance cannot be satisfied at the same time. [0004] The quality of tin alloy powder directly affects the quality of solder paste. At present, the tin alloy powder on the market still has the following problems, such as poor oxidation resistance, high brittleness, insufficient toughness, easy vibration failure, and poor co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/40
CPCB23K35/262B23K35/362B23K35/40
Inventor 陈钦罗登俊徐华侨张义宾梁少杰徐衡陈旭
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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