A glass cutting edge coating process
A glass and process technology, applied in the field of glass cutting edge coating process, can solve the problems of glass acid and alkali corrosion resistance, poor anti-oxidation performance, anti-microbial performance, large roughness, glass breakage, etc., to improve acid and alkali corrosion resistance Performance, strong anti-microbial ability, good chemical stability
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Embodiment 1
[0027] A glass cutting edge coating process, comprising the following steps:
[0028] S1 Cut ordinary glass with a glass cutting machine according to the size requirements to obtain the substrate;
[0029] S2 Place the cut substrate in a double-sided edging machine, and roughly grind the four cutting edges of the substrate, using a No. 9 grinding wheel with a grinding head speed of 15 rpm and a rough grinding time of 10 minutes;
[0030] S3 puts the substrate roughly ground in step S2 in a polishing machine, and polishes the four cutting edges of the substrate. The rotating speed of the polishing disc is 20rmp, and the polishing time is 10min. 2nm substrate;
[0031] S4 Use a high-pressure water gun to wash the four cutting edges of the substrate, the pressure is 20Mpa, and the water flow rate is 10L / min. The purpose is to clean the polished cutting edges and remove the dust in the cracks of the cutting edges;
[0032] S5 Clean the substrate with clean water, cover the front...
Embodiment 2
[0036] A glass cutting edge coating process, comprising the following steps:
[0037] S1 Cut ordinary glass with a glass cutting machine according to the size requirements to obtain the substrate;
[0038] S2 Place the cut substrate in a double-sided edging machine, and roughly grind the four cutting edges of the substrate, using a No. 9 grinding wheel with a grinding head speed of 15 rpm and a rough grinding time of 10 minutes;
[0039] S3 puts the substrate roughly ground in step S2 in a polishing machine, and polishes the four cutting edges of the substrate. The rotating speed of the polishing disc is 20rmp, and the polishing time is 10min. 2nm substrate;
[0040] S4 Use a high-pressure water gun to wash the four cutting edges of the substrate, the pressure is 20Mpa, and the water flow rate is 10L / min. The purpose is to clean the polished cutting edges and remove the dust in the cracks of the cutting edges;
[0041] S5 Clean the substrate with clean water, cover the front...
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