Bottom plate structure suitable for welding of microwave power chip

Abstract

The invention proposes a bottom plate structure suitable for welding of a microwave power chip. The bottom plate structure comprises a bottom surface and a bulge, wherein the bulge is arranged in thecenter of the bottom surface, a part of the bulge is embedded into a microwave cavity, a shell of the bottom plate structure employs a metal material approximate to a thermal expansion coefficient ofthe microwave chip, the interior of a bottom plate is of a hollow structure, a liquid absorption core is filled between the shell of the hollow structure and the shell of the bottom plate structure and is provided with a capillary structure, a working liquid is arranged in the capillary structure, heat generated by the microwave power chip is guided to the bottom plate by a welding surface, a partof the heat is guided out of two sides of the bottom surface of the bottom plate, a part of heat is guided out of the interior space of the bottom plate by the bulge part, repeated circulation of evaporation, convection, condensation, backflow and evaporation is formed by the capillary structure of the liquid absorption core and the working liquid in the capillary structure.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a bottom plate structure suitable for microwave power chip welding. Background technique [0002] Microwave chips, as the core components of microwave modules, are famous for their small size, high price and easy damage. For microwave chips with power functions (such as amplification and attenuation), due to the large power consumption and small size, the heat flux density is extremely high, and the bottom plate needs to have a very high thermal conductivity to conduct heat quickly. As the substrate, the bottom plate plays the role of protecting the chip, connecting and fixing, and conducting heat. It is also convenient to replace the chip when it is damaged. [0003] In practical application, the microwave chip is welded on the bottom plate first, and then the bottom plate is fixed in the microwave cavity with screws. The main material of the chip is generally aluminum nitrid...

AI Technical Summary

Problems solved by technology

[0009] The invention proposes a bottom plate structure suitable for microwave power chip welding, especially suitable for high-power chip welding, which solves the problem that the microwave chip is broken and damaged by the tension of the bottom plate caused by the difference in thermal expansion during the welding process. At the same time, The invention also increases the conduction speed of heat to ensure the reliability of the chip when it is working

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