Bottom plate structure suitable for welding of microwave power chip

A microwave power and chip welding technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of increasing conduction speed, breaking and destroying microwave chips, and achieving the effect of increasing conduction speed and ensuring reliability.

Inactive Publication Date: 2018-11-23
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The invention proposes a bottom plate structure suitable for microwave power chip welding, especially suitable for high-power chip welding, which solves the problem that the microwave chip is broken and damaged by the tensi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bottom plate structure suitable for welding of microwave power chip
  • Bottom plate structure suitable for welding of microwave power chip
  • Bottom plate structure suitable for welding of microwave power chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] For microwave power chips, due to the large power consumption and small size, the heat flux density is extremely high, and the bottom plate needs to have a very high thermal conductivity to conduct heat quickly. The main material of the chip is generally aluminum nitride or gallium arsenide, with a low linear thermal expansion coefficient (4.5 for aluminum nitride and 6.8 for gallium arsenide), while the base plate is generally a metal material with a hi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention proposes a bottom plate structure suitable for welding of a microwave power chip. The bottom plate structure comprises a bottom surface and a bulge, wherein the bulge is arranged in thecenter of the bottom surface, a part of the bulge is embedded into a microwave cavity, a shell of the bottom plate structure employs a metal material approximate to a thermal expansion coefficient ofthe microwave chip, the interior of a bottom plate is of a hollow structure, a liquid absorption core is filled between the shell of the hollow structure and the shell of the bottom plate structure and is provided with a capillary structure, a working liquid is arranged in the capillary structure, heat generated by the microwave power chip is guided to the bottom plate by a welding surface, a partof the heat is guided out of two sides of the bottom surface of the bottom plate, a part of heat is guided out of the interior space of the bottom plate by the bulge part, repeated circulation of evaporation, convection, condensation, backflow and evaporation is formed by the capillary structure of the liquid absorption core and the working liquid in the capillary structure.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a bottom plate structure suitable for microwave power chip welding. Background technique [0002] Microwave chips, as the core components of microwave modules, are famous for their small size, high price and easy damage. For microwave chips with power functions (such as amplification and attenuation), due to the large power consumption and small size, the heat flux density is extremely high, and the bottom plate needs to have a very high thermal conductivity to conduct heat quickly. As the substrate, the bottom plate plays the role of protecting the chip, connecting and fixing, and conducting heat. It is also convenient to replace the chip when it is damaged. [0003] In practical application, the microwave chip is welded on the bottom plate first, and then the bottom plate is fixed in the microwave cavity with screws. The main material of the chip is generally aluminum nitrid...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/13H01L23/14H01L23/367H01L23/473
CPCH01L23/13H01L23/14H01L23/3675H01L23/473
Inventor 吴强马建壮赵树伟张文兴曲志明王加路
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap