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Capillary structure of ultra-thin heat pipe and preparation method thereof

A capillary structure and manufacturing method technology, applied in the field of heat transfer, can solve the problems of poor capillary structure performance and complex manufacturing process, and achieve the effects of improving critical heat flow, increasing vaporization cores, and increasing vaporization degree

Active Publication Date: 2020-05-08
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] In order to solve the shortcomings of poor performance and complex manufacturing process of the existing ultra-thin heat pipe capillary structure, the purpose of the present invention is to provide an ultra-thin heat pipe capillary structure and its manufacturing method, the capillary structure can effectively improve the heat dissipation performance of the heat pipe, and manufacture Simple method, low cost, suitable for mass production

Method used

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  • Capillary structure of ultra-thin heat pipe and preparation method thereof
  • Capillary structure of ultra-thin heat pipe and preparation method thereof
  • Capillary structure of ultra-thin heat pipe and preparation method thereof

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Embodiment Construction

[0023] The present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings.

[0024] combine Figure 1-2 , the heat pipe capillary structure of the present invention includes a copper foil substrate 1 and a copper microcolumn array 2 arranged on the copper foil substrate 1, wherein the surface of the copper microcolumn array 2 has a micro or / and nanoscale porous structure 3 . Wherein, the micro-copper pillar array 2 is composed of cylindrical copper pillars arranged in a rectangular array with a diameter of 40 μm, a pitch of 20 μm, and a height of 50 μm.

[0025] combine Figure 3-4 , the preparation process of the heat pipe capillary structure of the present invention is as follows:

[0026] (1) Selection of substrate

[0027] In this embodiment, a copper foil with a thickness of 100 μm is selected as the substrate.

[0028] (2) Photolithography process

[0029] First put the copper foil substrate 1 into an ...

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Abstract

The invention discloses an ultra-thin heat tube capillary structure and a preparation method thereof. The capillary structure comprises a base plate and copper micro-column arrays which are arranged on the base plate, wherein the surfaces of the copper micro-column arrays are provided with micrometer or / and nanometer holes. The preparation method comprises the following steps: depositing the micro-column arrays made of Cu-Al2O3 nano-composite materials on the surface of the base plate by adopting a photo-etching technology and an electrochemical deposition method; soaking the deposited micro-column arrays in an NaOH solution; dissolving Al2O3 nano-particles to obtain the copper micro-column arrays of which the surfaces are provided with the micrometer or / and nanometer holes. The preparation method disclosed by the invention is simple, and because the surface of the prepared capillary structure has a porous structure, boiling heat transfer of a heat tube can be effectively enhanced, andthe critical heat flux of the heat tube is improved, so that the heat transfer performance of the heat tube can be obviously improved.

Description

technical field [0001] The invention relates to an ultra-thin heat pipe capillary structure and a preparation method thereof, belonging to the technical field of heat transfer. Background technique [0002] With the development of modern electronic technology, the size of electronic products is getting smaller and smaller, resulting in more and more compact electronic components, and a sharp increase in the heat generated per unit area. In order to meet the heat dissipation requirements of modern electronic products, flexible ultra-thin heat pipes came into being. As the most important part of the heat pipe, the quality of the capillary structure directly affects the heat transfer performance of the heat pipe. However, due to the small size and thin thickness of the ultra-thin heat pipe, it is difficult to apply the traditional capillary structure to the ultra-thin heat pipe. Processing technologies such as laser processing and electron beam etching are costly and inefficie...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 张平燕立培许晖史波李娇何虹
Owner GUILIN UNIV OF ELECTRONIC TECH
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