A kind of single crystal silicon nano film flexible transient electronic device, preparation method and application
A technology of transient electronic devices and nano-thin films, which is applied in electrical components, nanotechnology, nanotechnology, etc., and can solve problems such as inability to adapt to the application environment
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Embodiment 1
[0064] Embodiment 1 Sensitive information / technical anti-disclosure protection device
[0065] Field-effect transistors are the basis of logic and storage circuits, and almost any integrated circuit system can be prepared in the form of a flexible transient device by using the preparation process and the transient electronic technology involved in the present invention. Taking the most basic logic device unit field effect transistor in integrated circuits as an example, its physical photos and device structure are as follows: figure 2 , 3 shown. The device includes a metal electrode 1, a silicon nanofilm 2, a thermally oxidized silicon dioxide layer 3, a flexible substrate layer 5, a bottom-up spin-coated polyimide layer (~5 μm), a polydimethylsiloxane layer (~5 μm), polyimide film (12.5 μm), poly-α-methylstyrene 6, its thickness is about 4 μm; electrode pass 7 on thermally oxidized silicon dioxide layer; gate oxide layer 8 of the device, SiO from top to bottom 2 (72 nm),...
Embodiment 2
[0069] Example 2 Single-crystal silicon nano-thin film transient photodetector with ultra-high switching ratio
[0070] Using the standard process parameters introduced in the preparation method of the invention, the preparation and thinning of silicon nanometer thin film phototransistors on the SOI wafer are completed, and flexible devices are obtained.
[0071] pass Figure 9 The output characteristic curves for the device shown are operating and Figure 10 The photoelectric response characteristics under gate voltage regulation shown in , can confirm the bias working state required for the device to achieve ultra-high switching ratio. Under a certain gate voltage, the output current of the transistor increases significantly with the drain voltage first, and then tends to be stable. It can be seen from the figure that as the irradiation intensity increases, the photocurrent of the transistor increases almost linearly. It can be seen that changing the gate voltage can sign...
Embodiment 3
[0075] Example 3 On-Chip Integrated Self-Destructive High-Temperature Circuit Protection Device
[0076] Using the idea of device first and then thinning introduced in the present invention, silicon nanometer thin film integrated circuits are prepared on SOI wafers according to standard technology, and a PAMS transient failure trigger layer is added under silicon nanometer thin film transistors in a specific area.
[0077] Compared with bulk silicon materials, the source and drain regions of silicon nano-thin film transistors are completely depleted, and only the side is in contact with the channel, which eliminates the p-n junction in the vertical direction and significantly reduces the leakage of the transistor under high-temperature operating conditions; at the same time, the device adopts resistance High-temperature polyimide film flexible substrate, and add spin-coated polyimide stress buffer film layer in multi-layer structure. The above structural features can meet th...
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