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Homogenous low-heat-conductivity inorganic heat insulation board and preparation method thereof

An inorganic thermal insulation board and low thermal conductivity technology, applied in the field of new materials, can solve the problems of complex manufacturing process and increased cost, and achieve the effects of simple preparation process, improved toughness, and improved flame retardancy

Active Publication Date: 2018-10-26
南京红宝丽新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Vermiculite needs to be pretreated, which increases the cost and complicates the production process

Method used

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  • Homogenous low-heat-conductivity inorganic heat insulation board and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Preparation of inorganic materials: 65 parts by weight of 60-80 mesh emery, 10 parts by weight of calcium hydroxide of 100 mesh, 5 parts by weight of expandable graphite, and 5 parts by weight of α-alumina trihydrate;

[0040] The preparation of component A of rigid polyurethane foaming material: 100 parts by weight of polyester polyol PS-2502 (Stepan), 4.0 parts by weight of dimethylcyclohexylamine, 0.5 parts by weight of dibutyltin dilaurate, HCFC-141b 23 parts by weight, 2 parts by weight of water, 10 parts by weight of tris (2-chloropropyl) phosphate, 10 parts by weight of dimethyl methyl phosphate, 1.15 parts by weight of foam stabilizer AK8805 (Mei Si De); Preparation: Take 211 parts by weight of polyphenyl polymethylene polyisocyanate M20S (Basf).

[0041] The dried inorganic materials are prepared into a mixture in proportion, and the temperature during mixing is 15°C; the mixture is continuously conveyed, and at the same time, continuously metered polyurethane ...

Embodiment 2

[0043] Preparation of inorganic materials: 16 parts by weight of lime powder of 2000 mesh, 20 parts by weight of waste glass powder of 50-100 mesh, 5 parts by weight of aluminum silicate fiber with a fiber length of 1.0-3.5 mm, and 10 parts by weight of borax;

[0044] Preparation of component A of rigid polyurethane foaming material: 27 parts by weight of polyether polyol HP2502 (Hongbaoli), 73 parts by weight of polyester polyol HF-8730 (Huafeng), and 1.9 parts by weight of triethylenediamine , 0.4 parts by weight of potassium isooctanoate-dipropylene glycol solution, 8 parts by weight of pentane, 7 parts by weight of HFC-245fa, CO 2 5 parts by weight, 1.6 parts by weight of water, 5 parts by weight of tris(2-chloropropyl) phosphate, 1.1 parts by weight of foam stabilizer B8460 (Degussa); the preparation of B component: take polyphenylpolymethylene 221 parts by weight of polyisocyanate PM-400 (Wanhua Chemical).

[0045] The dried inorganic materials are prepared into a mixt...

Embodiment 3

[0047] Preparation of inorganic materials: 5 parts by weight of 60-mesh fly ash, 25 parts by weight of quartz sand of 140-200 mesh, 10 parts by weight of expanded perlite of 200-270 mesh, 10 parts by weight of hollow glass microspheres of 400 mesh, 10 parts by weight of magnesium hydroxide Parts by weight, 2 parts by weight of antimony oxide;

[0048] Preparation of filler: get 5 parts by weight of rice husk, 5 parts by weight of bark;

[0049] Preparation of component A of rigid polyurethane foaming material: take 100 parts by weight of polyether polyol H4110 (Hongbaoli), 2.0 parts by weight of triethanolamine, 1,3,5-tris(dimethylaminopropyl) symmetrical hexahydro 1.5 parts by weight of triazine, 4.2 parts by weight of water (2.0 parts by weight of water are used as blowing agent), 15 parts by weight of diphenylisooctyl phosphate, 3.0 parts by weight of foam stabilizer AK8830 (Meister); the preparation of B component : Take 189 parts by weight of polyphenyl polymethylene pol...

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Abstract

The invention discloses a homogenous low-heat-conductivity inorganic heat insulation board and a preparation method thereof. The homogenous low-heat-conductivity inorganic heat insulation board is prepared from the reaction of an inorganic material, filler and polyurethane hard foam and prepared from the following raw materials in parts by weight: 31 to 85 parts of the inorganic material, 0 to 20parts of the filler, and 15 to 49 parts of the polyurethane hard foam. The heat conduction coefficient of the prepared insulation board is less than 40mW / (m.K), the integral density is 35 to 500 kg / m<3>, and the thermal insulation and heat preservation performance is good. The compressive strength is greater than or equal to 0.1MPa, the tensile strength is greater than or equal to 0.1MPa, the mechanical strength is high, and the durability is good. The oxygen index is greater than or equal to 30 percent, the combustion growth rate index is less than or equal to 120W / s, the total heat release amount in 600s is less than or equal to 7.5MJ, and the homogeneous low-heat-conductivity inorganic insulation board is difficult to combust and high in fireproof grade. The preparation process is simple and suitable for the industrialized production.

Description

technical field [0001] The invention belongs to the field of new materials, and in particular relates to a homogeneous and low-thermal-conduction inorganic thermal insulation board and a preparation method thereof. Background technique [0002] Buildings are major energy and carbon emitters. Vigorously promoting green buildings and environmentally friendly and energy-saving building materials is an important measure to improve the ambient air quality, and it is also the meaning of the question to practice the "green" development concept. Existing building insulation materials include inorganic insulation materials and organic insulation materials. At present, my country uses mainly organic thermal insulation materials such as phenolic, polyurethane, and polystyrene. Organic thermal insulation materials are light in weight, good in thermal insulation effect, and easy to construct, but they are flammable. Although there are corresponding technologies to improve the fire res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/30C04B28/12C04B111/28
CPCC04B28/12C04B28/30C04B2111/28C04B2201/20C04B2201/32C04B2201/50C04B14/324C04B14/024C04B22/06C04B16/082C04B14/22C04B14/4656C04B22/08C04B18/08C04B14/06C04B14/185C04B18/248C04B18/26
Inventor 袁海顺韦华诸爱东傅振华邢小刚黄建华祝丽娟杨志峰
Owner 南京红宝丽新材料有限公司
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