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Multilayered capacitor and board having the same mounted thereon

A technology of multilayer capacitors and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., and can solve problems such as product warpage

Active Publication Date: 2018-10-23
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In addition, in the bottom electrode structure, due to the difference in the shrinkage rate of the main body and that of the external electrodes formed on the mounting surface (bottom surface) of the main body, a camber phenomenon in which the upper part of the product protrudes upward may occur.

Method used

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  • Multilayered capacitor and board having the same mounted thereon
  • Multilayered capacitor and board having the same mounted thereon
  • Multilayered capacitor and board having the same mounted thereon

Examples

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Embodiment Construction

[0018] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings as follows. In the drawings, the shapes, sizes, etc. of components may be exaggerated or reduced for clarity.

[0019] This disclosure may, however, be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0020] Throughout this specification, it will be understood that when an element such as a layer, region, or wafer (or substrate) is referred to as being "on," "connected to," or "bonded to" another element, When an element is referred to as an element, it may be directly "on", "connected to" or "coupled to" another element or other elements may be present therebetween. In contrast, when an element is referred to as b...

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Abstract

The invention provides a multilayered capacitor and a board having the same mounted thereon. The multilayer capacitor includes a capacitor body including a dielectric layer and a first internal electrode and a second internal electrode; a first via electrode exposed through first and second surfaces of the capacitor body, connected to the first internal electrode and spaced apart from the second internal electrode, a second via electrode exposed through the first and second surfaces of the capacitor body, and connected to the second internal electrode and spaced apart from the first internal electrode, a first and second external electrodes disposed on the first surface of the capacitor body to be spaced apart from each other, and connected to the first and the second via electrodes, respectively, and first and second covers disposed in sequence from a bottom in the second surface of the capacitor body, wherein the first and second cover are formed of different materials.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2017-0046860 filed in the Korean Intellectual Property Office on April 11, 2017, the entire disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer capacitor and a board on which the multilayer capacitor is mounted. Background technique [0003] Multilayer capacitors (multilayer chip electronic components) are mounted on various types of electronic devices including display devices (such as liquid crystal displays (LCDs), plasma display panels (PDPs), etc.), computers, personal digital assistants (PDAs), mobile phones, etc. on the board of electronic products, and is used for charging or discharging. [0004] The multilayer capacitor is small, the capacitance of the multilayer capacitor is secured, and mounting of the multilayer capacitor is easily performed. Due to the advantages described above, such multilayer...

Claims

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Application Information

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IPC IPC(8): H01G4/242
CPCH01G4/242H01G2/065H01G4/12H01G4/1227H01G4/224H01G4/232H01G4/30H05K1/181H05K2201/10015H05K2201/10636Y02P70/50H01G4/012H05K1/115
Inventor 李孝妍李泽正李源英安圣权朱镇卿郑镇万
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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