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Laminate type ceramic electronic component and manufacturing method therefor

一种电子部件、制造方法的技术,应用在固定电容的零部件、叠层电容器、固定电容器电极等方向,能够解决层叠型陶瓷电子部件可靠性降低、部件主体易产生间隙、镀膜产生裂纹等问题,达到固定力优良、固定力或者密封性提高、耐湿可靠性提高的效果

Active Publication Date: 2012-03-14
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the coating film is soft, cracks are less likely to occur on the coating film, but due to the above-mentioned stress, the coating film will peel off and a gap will easily occur between the part body and the component body.
Therefore, moisture infiltrates into the gap, resulting in deterioration of insulation resistance, which may lower the reliability of multilayer ceramic electronic parts
On the other hand, if the plated film becomes hard, the fixing force increases, the plated film becomes brittle, and cracks occur on the plated film, thereby reducing the reliability of multilayer ceramic electronic components.

Method used

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  • Laminate type ceramic electronic component and manufacturing method therefor
  • Laminate type ceramic electronic component and manufacturing method therefor
  • Laminate type ceramic electronic component and manufacturing method therefor

Examples

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Embodiment Construction

[0041] For the structure of a multilayer ceramic capacitor as a multilayer ceramic electronic component according to one embodiment of the present invention, refer to Figure 1 to Figure 4 And it demonstrates by its manufacturing method.

[0042] for manufacturing image 3 Multilayer ceramic capacitors shown in 1, prepare the figure 2 Part body 2 shown. Additionally, in order to get figure 2 The parts shown in Body 2, prepare the figure 1 Two kinds of ceramic green sheets 3 and 4 are shown.

[0043] exist figure 1 The first internal electrodes 5 are formed on the ceramic green sheet 3 shown in (A). The first internal electrode 5 has a capacitance forming portion 6 and a lead portion 7 constituting its main parts. The lead-out portion 7 extends so as to reach one short side of the ceramic green sheet 3 and a part of two long sides adjacent thereto, and constitutes an exposed end there.

[0044] On the other hand, in figure 1 The second internal electrode 8 is form...

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PUM

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Abstract

In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni-B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni-B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

Description

technical field [0001] The present invention relates to a laminated ceramic electronic component and its manufacturing method, in particular to a laminated ceramic electronic component including a plating film formed by direct plating on an external electrode in such a manner as to be electrically connected to a plurality of internal electrodes, and a manufacturing method thereof. Background technique [0002] Such as Figure 5 As shown, a multilayer ceramic electronic component 101 represented by a multilayer ceramic capacitor generally has a component body 105 of a laminated structure. The component body 105 includes, for example, a plurality of stacked ceramic layers 102 made of dielectric ceramics, A plurality of layered internal electrodes 103 and 104 are formed at the interface between the ceramic layers 102 . On one and the other end faces 106 and 107 of the component main body 105 , respective end portions of the plurality of internal electrodes 103 and the plurality...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/232H01G4/30
CPCH01G4/005H01G4/30Y10T29/43Y10T29/435H01G4/12
Inventor 猿喰真人小川诚元木章博笹林武久榧谷孝行
Owner MURATA MFG CO LTD
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