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LED device and LED lamp

A technology of LED devices and light-transmitting plates, applied in electric solid devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as failure of LED devices, and achieve the effect of avoiding failure, avoiding quality defects, and protecting eyes

Inactive Publication Date: 2018-10-16
SHENZHEN LINGDU INTELLIGENT CONTROL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide an LED device and an LED lamp, aiming to solve the problem of failure and glare caused by aging and corrosion of LED devices

Method used

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0026] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0027] In addition, in t...

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Abstract

The invention discloses an LED device and an LED lamp. The LED device comprises a substrate, a first light-transmitting plate and a second light-transmitting plate, wherein a cavity is formed in the substrate, an opening is formed in one end of the cavity, the opening end of the cavity extends along the radial direction of the cavity to form a step surface, and a sealing groove is formed in the peripheral surface of the cavity; the first light-transmitting plate is arranged on the step surface, and a seal ring is arranged between the first light-transmitting plate and the step surface; the second light-transmitting plate comprises a periphery part and a middle part, an annular bulge is arranged between the periphery part and the middle part, the thickness of the periphery part is smaller than that of the middle part, the middle part and the cavity are oppositely arranged, the middle part is laminated onto the first light-transmitting plate, the annular bulge is tightly matched with theseal groove, a drying agent is filled between the annular bulge and the seal groove, a sealing adhesive glue is arranged between the periphery part and the substrate, a concave spherical surface is formed on the middle part, an opening of the concave spherical surface faces the light-transmitting plate, and the concave spherical surface is internally provided with a plurality of glass beads. Through the technical scheme, double-isolation external corrosive substances are adopted, the failure rate of the LED device can be improved effectively, and the LED device has an anti-glare effect.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED device and an LED lamp. Background technique [0002] LED (Light Emitting Diode), commonly known as light-emitting diode, as a semiconductor component, based on its semiconductor characteristics, LED is very sensitive to the current passing through it, and a very small current can make it glow, so LED lamps are used as energy-saving lamps. widely used. At present, in the production process of LED devices, light-transmitting organic materials such as silica gel and epoxy resin are usually used to seal and protect the LED light-emitting part (mainly referring to the LED chip). It is easy to age or undergo chemical reactions in harsh environments, and the contact surface between sealing materials such as silica gel and epoxy resin and the LED chip mounting substrate (metal) is formed to allow external corrosive substances (such as water vapor, corrosive gases, etc.) to ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/58H01L23/00
CPCH01L33/483H01L23/564H01L33/58
Inventor 徐瑞
Owner SHENZHEN LINGDU INTELLIGENT CONTROL TECH CO LTD
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