Preparation method of inclined table and preparation method of detector
A detector and mesa technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as jagged side walls and increased leakage current on the device surface
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[0034] Please refer to figure 1 , the preparation method of inclined table comprises:
[0035] Step S101, coating a photoresist layer on the mesa region of the wafer.
[0036] In the embodiment of the present invention, the wafer is a silicon carbide wafer, a gallium nitride wafer or other wafers capable of producing avalanche photodiodes. Preferably, the wafer is a silicon carbide wafer. Silicon carbide material is the preferred material for the preparation of ultraviolet photodetection devices due to its advantages such as large band gap, good thermal conductivity, high electron saturation drift velocity, stable chemical properties and low defect density. The mesa area of the wafer is the area where the prepared mesa is located, please refer to figure 2 , coating a photoresist layer 206 on the mesa region of the wafer by spin coating.
[0037] Optionally, the wafer from bottom to top is substrate, silicon carbide P + layer, SiC N layer, SiC N - layer and SiC N + la...
Embodiment 2
[0051] Please refer to image 3 , the preparation method of detector, comprising:
[0052] In step S301, a mesa is prepared on the wafer by the method described in Embodiment 1 of the present invention.
[0053] In the embodiment of the present invention, please refer to figure 2 , a mesa with a preset inclination angle and smooth sidewalls is prepared on the wafer by the method described in Embodiment 1 of the present invention.
[0054] Step S302 , preparing an ohmic contact electrode in the ohmic contact electrode area of the wafer after the mesa is prepared.
[0055] In the embodiment of the present invention, please refer to Figure 4 , the ohmic contact electrode 207 is located on the upper surface of the mesa and the upper surface of the non-mesa area, wherein the non-mesa area is the area of the wafer other than the mesa area. The ohmic contact electrode 207 on the upper surface of the mesa is an N-type electrode, the ohmic contact electrode 207 on the upper s...
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