Novel inorganic heat-insulating board prepared through normal-temperature foaming of perlite powder and preparation method thereof

A technology of inorganic insulation board and perlite powder, which is applied in the field of building exterior wall insulation materials, can solve the problems of small thermal conductivity, high thermal conductivity, and low compressive strength, and achieve good thermal insulation performance, high mechanical strength, and water resistance. excellent effect

Active Publication Date: 2018-09-28
CHINA UNIV OF GEOSCIENCES (BEIJING)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, currently commercially available inorganic thermal insulation materials generally have defects such as high thermal conductivity, low compressive strength, high water absorption, and poor durability.
The traditional expanded perlite insulation board uses expanded perlite particles as the main raw material. Although it has the characteristics of small thermal conductivity and high temperature resistance, the production process of expanded perlite needs to be heated to about 1300°C to make it expand at high temperature. The process consumes a lot of energy
At the same time, in the process of mining and production of perlite, a large amount of discarded fine tailings are produced, resulting in a serious waste of resources

Method used

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  • Novel inorganic heat-insulating board prepared through normal-temperature foaming of perlite powder and preparation method thereof
  • Novel inorganic heat-insulating board prepared through normal-temperature foaming of perlite powder and preparation method thereof
  • Novel inorganic heat-insulating board prepared through normal-temperature foaming of perlite powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] Mix 50 parts of perlite powder or its tailings powder, 0.6 parts of sodium dodecyl sulfonate, and 0.8 parts of organosilicon hydrophobic powder, and then add 42 parts of water glass with a modulus of 3.2 and 4 parts of hydrogen peroxide, mix and stir evenly, to obtain a mixed material;

[0097] The obtained mixture was injected into the mold, leveled, covered with a perforated lid and foamed for 24 hours;

[0098] The foamed product was placed in a constant temperature oven, dried at 60°C for 24 hours, demolded after drying, and the demolded plate was placed in a muffle furnace and sintered at 500°C for 30 minutes;

[0099] The sintered plate was immersed in an organosilicon solution of organosilicon / water = 1 / 60 for 10 minutes, and finally the dipped plate was dried in a constant temperature drying oven at 60°C to obtain the final product.

[0100] The performance indicators of the sample are as follows: density=150kg / m 3 , compressive strength = 0.56MPa, thermal con...

Embodiment 2

[0102]Mix 50 parts of perlite powder or its tailings powder, 0.6 parts of sodium dodecyl sulfonate, 0.8 parts of silicone hydrophobic powder, and then add 42 parts of water glass with a modulus of 1.2 and 4 parts of hydrogen peroxide, mix and stir well , to obtain a mixed material;

[0103] The obtained mixture was injected into the mold, leveled, covered with a perforated lid and foamed for 24 hours;

[0104] The foamed product was placed in a constant temperature oven, dried at 60°C for 24 hours, demolded after drying, and the demolded plate was placed in a muffle furnace and sintered at 500°C for 30 minutes;

[0105] The sintered plate was immersed in an organic silicon solution of silicone / water = 1 / 60 for 10 minutes, and finally the immersed plate was dried in a constant temperature drying oven at 60°C.

[0106] The performance indicators of this sample are as follows: density=170kg / m 3 , compressive strength = 0.7MPa, thermal conductivity = 0.052W / (m·K), volume water a...

Embodiment 3

[0108] 50 parts of perlite powder or its tailings powder, 42 parts of modulus are the water glass of 3.2 molds, 0.2 part of CTAB, 4 parts of rock wool are mixed; Add 4 parts of hydrogen peroxide and mix and stir to obtain mixed material;

[0109] The obtained mixture was injected into the mold, leveled, covered with a perforated lid and foamed for 24 hours;

[0110] The foamed product was placed in a constant temperature oven, dried at 60°C for 24 hours, demolded after drying, and the demolded plate was placed in a muffle furnace and sintered at 500°C for 30 minutes;

[0111] The sintered plate was immersed in an organosilicon solution of organosilicon / water = 1 / 60 for 10 minutes, and finally the dipped plate was dried in a constant temperature drying oven at 60°C to obtain the final product.

[0112] The performance indicators of the sample are as follows: density=180kg / m 3 , compressive strength = 0.45MPa, thermal conductivity = 0.050W / (m·K), volume water absorption = 2%, n...

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Abstract

The invention discloses a novel inorganic heat-insulating board prepared through normal-temperature foaming of perlite powder and a preparation method thereof. The novel inorganic heat-insulating board is prepared by taking perlite powder (containing perlite tailings) as a main raw material, adding a binder, a surfactant, a foamer, hydrophobic powder and inorganic fiber and adopting a normal-temperature foaming method. The heat-insulating board is low in heat conducting coefficient, high in compressive strength, low in water absorption rate, good in fireproof performance and high in durability. The preparation method is simple in process, mild in preparation condition, energy-saving and environment-friendly, waste perlite tailing powder can be utilized, resources are saved, and the novel inorganic heat-insulating board is suitable for large-scale industrial production.

Description

technical field [0001] The invention relates to the technical field of building exterior wall thermal insulation materials, in particular to a thermal insulation board prepared by using perlite powder at room temperature foaming and a preparation method thereof, and simultaneously proposes a method for efficiently utilizing perlite tailings. Background technique [0002] Building energy consumption accounts for a large proportion of the total energy consumption of the whole society, and the energy consumption of heating and cooling accounts for the vast majority in the building use process, which is mainly caused by the excessive heat exchange of the outer wall. The most important means of green energy-saving development in the building sector in my country is to install thermal insulation systems on buildings. The thermal insulation system is mainly composed of thermal insulation materials, and thermal insulation materials mainly include organic and inorganic thermal insula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B38/02C04B35/16C04B35/622C04B35/632C04B35/63C04B41/84
CPCC04B35/16C04B35/622C04B35/62204C04B35/6316C04B35/632C04B38/02C04B41/4905C04B41/84C04B2235/449C04B2235/77C04B2235/96C04B2235/9607C04B38/0067C04B41/4535
Inventor 廖立兵高欢刘昊梅乐夫吕国诚
Owner CHINA UNIV OF GEOSCIENCES (BEIJING)
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