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Chemical nickel plating liquid and preparation method

An electroless nickel plating solution and nickel salt technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve the problem of low utilization rate of hypophosphite, difficulty in process control and maintenance, high energy consumption, etc. question

Active Publication Date: 2018-09-21
WINSTAR CHEM SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the temperature of the plating solution is high, although the deposition speed of the acidic electroless nickel plating solution is fast, the high temperature has high requirements on the plating tank and heating equipment, high energy consumption, easy volatilization of the plating solution, poor stability of the plating solution, and the utilization of hypophosphite The rate is low, and at the same time it brings difficulties in process control and maintenance

Method used

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  • Chemical nickel plating liquid and preparation method
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preparation example Construction

[0047] The preparation method of described mercapto chitosan comprises the following steps:

[0048] Add chitosan, 1-hydroxybenzotriazole, and distilled water into the reactor, stir well, then add 2-mercapto-4-methyl-5-thiazoleacetic acid, 1-(3-dimethylaminopropyl )-3-ethylcarbodiimide hydrochloride, use 1mol / L sodium hydroxide to bring the pH of the reaction solution to 5, react at room temperature for 4h, add absolute ethanol, filter, dry under reduced pressure at 60°C for 10h, grind, Stored at low temperature at 5°C; the weight ratio of the chitosan to the 1-hydroxybenzotriazole and the distilled water is 1:0.7:30; the chitosan to the 2-mercapto-4-formazol The weight ratio of base-5-thiazoleacetic acid is 1:3.6; the 2-mercapto-4-methyl-5-thiazoleacetic acid and the 1-(3-dimethylaminopropyl)-3-ethyl carbon The molar ratio of diimine hydrochloride is 1:1.05; the weight ratio of the chitosan to the absolute ethanol is 1:10.

[0049] Chitosan has strong complexation and adsor...

Embodiment 1

[0071] A kind of chemical nickel plating liquid, described chemical nickel plating liquid comprises nickel salt, reducing agent, complexing agent, buffering agent, stabilizer, surfactant, deionized water; Wherein, by weight, 1000 parts of deionized water , 24 parts of nickel salt, 30 parts of reducing agent, 25 parts of complexing agent, 8 parts of buffering agent, 3 parts of stabilizer, 0.05 part of surfactant, 1.6 parts of nanoparticle, 1 part of cerium sulfate, 0.8 part of nano graphene, saccharin 2 copies;

[0072] The nickel salt is nickel sulfate; the nanoparticles are aluminum nitride nanoparticles and gallium nitride nanoparticles, the particle diameter of the aluminum nitride nanoparticles is 50nm, and the particle diameter of the gallium nitride nanoparticles is 40nm , the weight ratio of the aluminum nitride nanoparticles to the gallium nitride nanoparticles is 1:0.24; the reducing agent is sodium hypophosphite; the complexing agent is sodium citrate, mercapto chito...

Embodiment 2

[0081] A kind of chemical nickel plating liquid, described chemical nickel plating liquid comprises nickel salt, reducing agent, complexing agent, buffering agent, stabilizer, surfactant, deionized water; Wherein, by weight, 1000 parts of deionized water , 24 parts of nickel salt, 30 parts of reducing agent, 25 parts of complexing agent, 8 parts of buffering agent, 3 parts of stabilizer, 0.05 part of surfactant, 1.6 parts of nanoparticle, 1 part of cerium sulfate, 0.8 part of nano graphene, saccharin 2 copies;

[0082] The nickel salt is nickel sulfate; the nanoparticles are aluminum nitride nanoparticles and gallium nitride nanoparticles, the particle diameter of the aluminum nitride nanoparticles is 50nm, and the particle diameter of the gallium nitride nanoparticles is 50nm , the weight ratio of the aluminum nitride nanoparticles to the gallium nitride nanoparticles is 1:0.1; the reducing agent is sodium hypophosphite; the complexing agent is sodium citrate, mercapto chitos...

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Abstract

The invention provides chemical nickel plating liquid. The chemical nickel plating liquid is prepared from the following components: nickle salt, a reducing agent, a complexing agent, a buffering agent, a stabilizing agent, a surfactant and deionized water, wherein, the chemical nickel plating liquid is specially prepared from the components in parts by weight: 1000 parts of deionized water, 20 to35 parts of nickel salt, 15 to 32 parts of a reducing agent, 10 to 30 parts of a complexing agent, 2 to 12 parts of a buffering agent, 1 to 15 parts of a stabilizing agent, and 0.01 to 0.2 part of asurfactant. The nickel salt is one or more of nickel sulfate, nickel chloride, nickel acetate, nickel carbonate and nickel aminosulfonate.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroless nickel plating solution and a preparation method thereof. Background technique [0002] Electroless nickel plating, also known as electroless nickel plating or self-catalyzed nickel plating, is a nickel deposition process in which nickel ions are deposited on the metal surface by self-catalytic reduction through an appropriate reducing agent in the solution. In the circuit board, by forming a nickel layer between the copper circuit layer and the gold layer of the circuit board, the defects of poor solderability and short service life of the circuit board caused by the interdiffusion between copper and gold can be avoided. At the same time, the formed nickel The layer also increases the mechanical strength of the metal layer. [0003] The electroless Ni-P alloy coating has excellent wear resistance, corrosion resistance, and weldability. The coating has the ...

Claims

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Application Information

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IPC IPC(8): C23C18/34C23C18/36
CPCC23C18/34C23C18/36
Inventor 张志恒
Owner WINSTAR CHEM SHANGHAI
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