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Halogen-free flame-retardant low-pressure packaging material with ultra-low dielectric property and preparation method thereof

A technology of ultra-low dielectric and packaging materials, which is applied in the field of ultra-low dielectric properties, halogen-free flame-retardant low-voltage packaging materials and its preparation, and can solve the problems of inapplicability of injection molded parts

Active Publication Date: 2018-09-14
INST OF CHEM ENG GUANGDONG ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dielectric loss tangent of the dimer acid polyamide material is 0.01-0.08 (1.8GHz), and due to the high polarity of polyamide, the dielectric loss tangent of the material is greatly affected by the ambient humidity, and its injection molding Parts are not suitable for high frequency (>4GHz) high humidity (>85%) insulation field

Method used

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  • Halogen-free flame-retardant low-pressure packaging material with ultra-low dielectric property and preparation method thereof
  • Halogen-free flame-retardant low-pressure packaging material with ultra-low dielectric property and preparation method thereof
  • Halogen-free flame-retardant low-pressure packaging material with ultra-low dielectric property and preparation method thereof

Examples

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preparation example Construction

[0052] The preparation method of the halogen-free flame-retardant low-voltage packaging material with ultra-low dielectric properties comprises the following steps:

[0053] 1) Under a protective atmosphere, dissolve dimer acid, dibasic acid, diamine and polyetherdiamine in a reactor, and form a salt at 20°C to 100°C;

[0054] 2) Add phosphoric acid, disperse evenly, heat up to 150°C-180°C, and react under stirring at 300r / min-800r / min for 0.2h-2h;

[0055] 3) Continue to heat up to 200°C to 250°C, vacuum the reaction system to <30mbar, and react for 0.2h to 2h under stirring at a speed of 50r / min to 300r / min to obtain a dimer acid type polyamide prepolymer;

[0056] 4) Add bifunctional polyphenylene ether, disperse evenly, cool down to 150°C-200°C, add dibutyltin laurate and diisocyanate, and continue to react for 1h-3h to obtain dimer acid type polyamide material;

[0057] 5) Continue to add halogen-free flame retardant, antioxidant, hydrolysis stabilizer, UV stabilizer and...

Embodiment 1

[0072] A halogen-free flame-retardant low-voltage packaging material with ultra-low dielectric properties, the composition of which is shown in Table 1.

[0073] Table 1 Example 1 Formula composition of ultra-low dielectric performance halogen-free flame-retardant low-voltage packaging material

[0074]

[0075]

[0076] Example 1 The preparation method of an ultra-low dielectric performance halogen-free flame-retardant low-voltage packaging material includes the following steps:

[0077] 1) Under the protection of nitrogen gas, dissolve dimer acid, sebacic acid, ethylenediamine, and polyetherdiamine in an 8L reactor, and raise the temperature to 60°C to form a salt.

[0078] 2) After adding the phosphoric acid catalyst and dispersing evenly, raise the temperature to 160°C and react for 1 hour under rapid stirring at 600r / min.

[0079] 3) Continue to increase the temperature to 230°C, keep the temperature constant, and vacuumize the reaction system to 20mbar, then maint...

Embodiment 2

[0083] A halogen-free flame-retardant low-voltage packaging material with ultra-low dielectric properties, the composition formula of which is shown in Table 2.

[0084] Table 2 Example 2 Formula composition of ultra-low dielectric performance halogen-free flame-retardant low-voltage packaging material

[0085]

[0086]

[0087] Example 2 The preparation method of an ultra-low dielectric performance halogen-free flame-retardant low-voltage packaging material includes the following steps:

[0088] 1) Under the protection of helium gas, dissolve dimer acid, adipic acid, butylenediamine, and polyetherdiamine in a 6L reactor, and raise the temperature to 70°C to form a salt.

[0089] 2) After adding the phosphoric acid catalyst and dispersing evenly, raise the temperature to 170°C and react for 1.5h under rapid stirring at 700r / min.

[0090]3) Continue to raise the temperature to 240°C, keep the temperature constant, and vacuumize the reaction system to 30mbar, then maintai...

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Abstract

The invention discloses a halogen-free flame-retardant low-pressure packaging material with ultra-low dielectric property and a preparation method thereof. The halogen-free flame-retardant low-pressure packaging material is prepared from dimer acid, dibasic acid, diamine, polyether diamine, difunctional polyphenylene ether, diisocyanate, a halogen-free flame retardant, an antioxidant, a hydrolysisstabilizer, a UV stabilizer, a colorant, phosphoric acid, and dibutytin laurate. The invention also discloses a preparation method of the halogen-free flame-retardant low-pressure packaging materialwith ultra-low dielectric property. The packaging material disclosed by the invention has ultra-low dielectric loss and halogen-free flame retardant performance, and is suitable for electronic components which are manufactured with low-pressure injection molding process and can be applied to the field of high-frequency communication, and especially suitable for the field of fast and efficient packaging of sensitive high-frequency electronic components.

Description

technical field [0001] The invention relates to an ultra-low dielectric performance halogen-free flame-retardant low-voltage packaging material and a preparation method thereof. Background technique [0002] Polyphenylene ether is a high-strength, low-dielectric loss material first developed and developed by General Electric of the United States in the 1960s, referred to as PPO or PPE. With the continuous development of copolymerization modification technology in the synthesis of polyphenylene ether, many varieties have been formed, the most representative of which is 2,6-dimethyl polyphenylene oxide, whose output accounts for about all 90% of the total value of polyphenylene ether production. The amorphous density of polyphenylene ether is 1.06g cm -3 , is the lightest variety of all engineering plastics, which makes polyphenylene ether have great advantages in the process of lightening electronic equipment. There is no hydrophilic group in the molecular structure of pol...

Claims

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Application Information

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IPC IPC(8): C08G18/67C08G18/48C08G69/40C08G69/34C08K5/3492C08K5/134C08K5/29
CPCC08G18/4879C08G18/6705C08G69/34C08G69/40C08K5/1345C08K5/29C08K5/34928
Inventor 彭小权李伟浩麦裕良李华亮洪仰婉高茜斐
Owner INST OF CHEM ENG GUANGDONG ACAD OF SCI
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