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Plastic encapsulating die of LED light source

A technology of LED light source and plastic encapsulation mold, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as slow extrusion of glue, damage to LED light source, etc., to achieve uniform distribution of glue amount, suitable glue amount, and convenient glue injection process. Effect

Pending Publication Date: 2018-08-17
SHENZHEN DICOLOR OPTOELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The small pitch of the LED display has become a trend. When the light source of the small pitch is plastic-sealed, the original extrusion-type plastic seal is not suitable, and the glue will be squeezed too slowly, and the glue head will collide with the LED light source and cause damage.

Method used

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  • Plastic encapsulating die of LED light source
  • Plastic encapsulating die of LED light source
  • Plastic encapsulating die of LED light source

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0026] The LED light source is the light-emitting diode light source. For the convenience of description, the light-emitting diode light source is referred to as the LED light source for short throughout the text. It is widely used because of its high brightness and low power consumption, and it specifically includes a PCB board, an LED light source (LED lamp bead) arranged on the PCB board and coupled with a driving chip through the PCB board. Generally, the driver chip and the LED...

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Abstract

The invention discloses a plastic encapsulating die of a LED light source. An upper die and a lower die are buckled during glue injection to form a closed space which is used for containing the LED light source and a film fixed on the lower die. A first air extraction reserved hole is formed in the middle of the upper die, a press block is arranged at the lower end of the upper die, and a second air extraction reserved hole is formed in a position, opposite to the first air extraction reserved hole, of the press block. The first and second air extraction reserved holes are used for vacuumizingthe closed space, and the press block is heated to melt the film so as to plastically encapsulating a LED module in the closed space. By the plastic encapsulating die, air bubbles in the process of glue encapsulating can be avoided effectively, and encapsulating yield is increased.

Description

technical field [0001] The application relates to the field of LED displays, in particular to a plastic sealing mold for LED light sources. Background technique [0002] As the scientific research and production of traditional components gradually mature, the electronic component industry is entering a new period of product upgrading and deepening development driven by new materials, new processes, and new technologies. The direction of miniaturization is developing, and, with the overall development of the electronic information industry, new requirements are put forward for the development of the electronic component industry. [0003] With the continuous improvement of the miniaturization process of various electronic products, higher requirements are put forward for the small size and high performance of electronic components. How to meet the requirements of complete plastic packaging of small-point-pitch light sources for LED displays while ensuring product performance ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/52H01L21/56
CPCH01L33/52H01L21/565H01L2933/005
Inventor 吴明金王周坤徐陈爱
Owner SHENZHEN DICOLOR OPTOELECTRONICS
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