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Superhard resin grinding wheel for thinning gallium arsenide wafer and preparation method of superhard resin grinding wheel

A wafer thinning and resin grinding wheel technology, which is applied in the field of grinding wheels, can solve the problems of rough grinding, reduce work efficiency, and reduce the life of grinding wheels, so as to reduce the damaged layer, improve the surface quality, and ensure the effect of not reducing

Active Publication Date: 2018-08-10
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the gallium arsenide wafer rough grinding wheel uses a 600-mesh grinding wheel, the damage layer can be reduced, but the introduction of the 600-mesh grinding wheel cannot perform rough grinding according to the working parameters of the 325-mesh grinding wheel, which greatly reduces the work efficiency and the life of the grinding wheel.

Method used

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  • Superhard resin grinding wheel for thinning gallium arsenide wafer and preparation method of superhard resin grinding wheel
  • Superhard resin grinding wheel for thinning gallium arsenide wafer and preparation method of superhard resin grinding wheel
  • Superhard resin grinding wheel for thinning gallium arsenide wafer and preparation method of superhard resin grinding wheel

Examples

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Effect test

Embodiment 1

[0030] A superhard resin grinding wheel, made of resin liquid, mixed cresol and solid material according to the mass ratio of 1:2:150 (that is, the mixture of resin liquid and mixed cresol: solid material is 1:50); wherein, the The solid material is composed of the following raw materials in parts by volume: 32 parts of diamond, 12 parts of silicon carbide, 2 parts of cobalt oxide, 12 parts of ceramic bond, 35 parts of phenolic resin, and 2 parts of calcium oxide.

[0031] The preparation method of above-mentioned superhard resin emery wheel, comprises the following steps:

[0032] (1) Mill the phenolic resin with a liquid nitrogen ball mill for 168 hours, and then pass it through a 280-mesh sieve to obtain a powdery phenolic resin. First, take the raw materials of the solid material according to the volume, and then weigh the resin liquid and mix it according to the mass ratio. Cresol;

[0033] (2) Submerge the diamond in an acid solution at 80°C, stir for 20 minutes, then s...

Embodiment 2

[0040]A superhard resin grinding wheel, made of resin liquid, mixed cresol and solid material in a mass ratio of 1:2:129 (that is, the mixture of resin liquid and mixed cresol: solid material is 1:43); wherein, the The solid material is composed of the following raw materials in parts by volume: 28 parts of diamond, 14 parts of silicon carbide, 3 parts of cobalt oxide, 13 parts of ceramic bond, 30 parts of phenolic resin, and 1 part of calcium oxide.

[0041] The preparation method of above-mentioned superhard resin emery wheel, comprises the following steps:

[0042] (1) Mill the phenolic resin with a liquid nitrogen ball mill for 168 hours, and then pass it through a 280-mesh sieve to obtain a powdery phenolic resin. First, take the raw materials of the solid material according to the volume, and then weigh the resin liquid and mix it according to the mass ratio. Cresol;

[0043] (2) Submerge the diamond in an acid solution at 90°C, stir for 20 minutes, then separate the so...

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Abstract

The invention discloses a superhard resin grinding wheel for thinning a gallium arsenide wafer. The superhard resin grinding wheel is formed by mixing a liquid material with a solid material accordingto the mass ratio of 1: (40-55). The liquid material is formed by uniformly mixing liquid resin with mixed cresol according to the mass ratio of 1: (1-2). The solid material comprises, by volume part, 28-40 parts of diamond, 8-15 parts of silicon carbide, 1-4 parts of cobalt oxide, 9-13 parts of a ceramic bond, 28-35 parts of phenolic resin and 1-3 parts of calcium oxide. The invention further discloses a preparation method of the superhard resin grinding wheel. The prepared superhard resin grinding wheel for thinning the gallium arsenide wafer is sintered by two steps, and therefore, the chipping containing capacity achieved at the high porosity, namely approximately 40%, is guaranteed; the grinding wheel is high in frame structure strength and long in service life; when the grinding wheel is used, the high feed rate is achieved, and it is guaranteed that work efficiency is not deteriorated and the service life is not shortened; and meanwhile, by means of granularity refining, a damaged layer is reduced, and surface quality is improved.

Description

technical field [0001] The invention belongs to the technical field of grinding wheels, and in particular relates to a superhard resin grinding wheel for gallium arsenide wafer thinning and a preparation method thereof. Background technique [0002] Gallium arsenide wafers belong to III-V compound semiconductors, the chemical formula is GaAs, the molecular weight is 144.63, and the band gap is 1.4 electron volts. Gallium arsenide wafers can be made into semi-insulating high-resistivity wafers with resistivity higher than that of silicon and germanium by more than 3 orders of magnitude. Resistive materials, used to make integrated circuit substrates, infrared detectors, r-photon detectors, etc. Semiconductor devices made of gallium arsenide wafers have the advantages of high temperature, high frequency, low temperature performance, low noise, and strong radiation resistance. Gallium arsenide wafer is a material with many advantages in semiconductor materials. However, due to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/00B24D3/34B24D3/18B24D3/32B24D18/00
CPCB24D3/00B24D3/18B24D3/285B24D3/32B24D3/342B24D3/346B24D18/0009
Inventor 赵延军惠珍丁玉龙曹剑锋
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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