High-performance perovskite/organic semiconductor heterojunction type photoelectric detector
A technology of organic semiconductors and photodetectors, applied in semiconductor devices, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc., can solve the problems of small photocurrent response, high working voltage, complex structure, etc., achieve good application potential, and suppress impact , the effect of photoelectric response enhancement
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Embodiment 1
[0025] Schematic diagram of the structure of a high-performance perovskite / organic semiconductor heterojunction photodetector. figure 1 Shown: 101 is the transparent substrate BK7 glass, 102 is the transparent bottom electrode ITO, the thickness is 110 nanometers, 103 is the hole transport layer CuPC, the thickness is 50nm, 104 is the perovskite light-absorbing layer, the thickness is 300 nanometers, 105 empty The hole transport layer CuPC has a thickness of 50 nanometers, and 106 is a metal top electrode with a thickness of 80 nanometers.
[0026] The preparation method of perovskite / organic semiconductor heterojunction photodetector in Example 1 is as follows:
[0027] The ITO bottom electrode layer is formed by sputtering coating on BK7 glass, and the square resistance is less than 10Ω / □. Transfer the substrate into a vacuum chamber to grow 50 nm CuPc. Then put it into the glove box, dissolve MAI / PbI2 with a molar ratio of 1:1 in DMF to form a 40wt% CH3NH3PbI3 precursor s...
Embodiment 2
[0028] Embodiment 2, the preparation method of perovskite / organic semiconductor heterojunction photodetector is as follows:
[0029] The ITO bottom electrode layer is formed by sputtering coating on BK7 glass, and the square resistance is less than 10Ω / □. Into the glove box, spin-coat 4wt% Spiro-OMeTAD solution on the substrate at a speed of 4000RPM, anneal at 100 degrees Celsius for five minutes, and the film thickness is about 80nm. Dissolve MAI / PbI2 with a molar ratio of 1:1 in DMF to form a 40wt% CH3NH3PbI3 precursor solution, spin-coat at 3000RPM for 60 seconds, and anneal at 100 degrees for 5min to form a perovskite film with a thickness of about 280 nm . Then continue to use 4wt% Spiro-OMeTAD solution to spin-coat on the perovskite film at a speed of 4000RPM, with a thickness of about 80nm. The substrate is introduced into the vacuum chamber, and 80nm gold electrodes are grown to complete the preparation of the device.
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