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Ultrasonic machining method and device for glass substrates

A glass substrate and processing method technology, applied in the direction of stone processing tools, stone processing equipment, manufacturing tools, etc., can solve the problems of low production efficiency and product yield, improve product yield, improve surface quality, and improve service life Effect

Inactive Publication Date: 2018-07-27
雷索智能科技(苏州) 有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to overcome the deficiencies of the above-mentioned prior art, the present invention provides a method and device for ultrasonic processing of glass substrates, aiming at solving the technical problems of low production efficiency and product yield of glass substrates processed by existing processing methods

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  • Ultrasonic machining method and device for glass substrates
  • Ultrasonic machining method and device for glass substrates
  • Ultrasonic machining method and device for glass substrates

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Embodiment Construction

[0039] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0040] In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0041] It is to be understood that the ter...

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Abstract

The invention provides an ultrasonic machining method for glass substrates. The method comprises a preparation step in which a glass substrate is placed on a worktable and a material removing step inwhich the glass substrate which is subjected to the preparation step is machined by utilizing machining equipment along a preset machining path; and the material removing step is performed at a statethat the glass substrate does ultrasonic vibration according to a preset frequency and preset amplitude. According to the method, vibration impact is formed between the glass substrate and a tool of the machining equipment by virtue of ultrasonic vibration of the glass substrate, and miniature cracks can be formed at a contact surface between the glass substrate and the tool; then machining is performed with the rotary tool; not only is cutting force greatly lowered, but also machining efficiency is improved; and surface quality of the product can also be improved through the effects of hammering, cavitation, uncontinuous cutting and the like of ultrasonic vibration, and notches, edge burning, cracking and other defects are reduced, so that the yield of the product is improved, and the service life of the tool is prolonged. The invention further provides a glass substrate ultrasonic machining device which can be applied in the method.

Description

technical field [0001] The invention relates to the technical field of glass substrate processing, and more specifically, to an ultrasonic processing method and device for a glass substrate. Background technique [0002] Glass products are widely used in various industries, including the electronics industry. Examples of such applications include smartphones, tablet computers, smart TVs, handheld devices, and liquid crystal displays (LCDs). Traditionally, glass is produced in large sheets, and the large sheet of glass is cut into a glass substrate close to the product size with a slicer, laser cutting or water cutting equipment, and then the glass substrate is engraved (or called fine carving) into shape ( The main processing positions include the shape and small holes in the handset, home button, fingerprint recognition, camera, etc.), so as to obtain the glass cover. [0003] There are many disadvantages in the existing glass substrate processing methods. Taking engraving...

Claims

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Application Information

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IPC IPC(8): B24B1/04B24B41/06B28D1/00
CPCB24B1/04B24B41/068B28D1/003
Inventor 王惠明田刚季顺峰陆小萍王怡
Owner 雷索智能科技(苏州) 有限公司
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